Takada; Tamio
Patent Applications and Registrations
Patent applications and USPTO patent grants for Takada; Tamio.The latest application filed is for "production method for powdered core".
- Takada; Tamio - Kashiwa JP
- Takada; Tamio - Kashiwa-shi JP
- Takada, Tamio - Chiba JP
| Patent | Date |
|---|---|
| Production method for powdered core Grant 7,273,527 - Ishihara , et al. September 25, 2 | 2007-09-25 |
| Production method for powdered core Grant 7,211,158 - Ishihara , et al. May 1, 2 | 2007-05-01 |
| Production method for powdered core App 20070051430 - Ishihara; Chio ; et al. | 2007-03-08 |
| Dust ccre and process for producing the same App 20050265883 - Ishii, Kei ; et al. | 2005-12-01 |
| Method for producing dust core App 20050242460 - Ishihara, Chio ; et al. | 2005-11-03 |
| Thin plate member for semiconductor package and manufacturing method therefor Grant 6,172,415 - Ishijima , et al. January 9, 2 | 2001-01-09 |
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