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Patent applications and USPTO patent grants for TAKADA; Norihiko.The latest application filed is for "elastic wave device and method for manufacturing the same".
Patent | Date |
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Elastic Wave Device And Method For Manufacturing The Same App 20130205586 - TAKADA; Norihiko ;   et al. | 2013-08-15 |
Elastic wave device and method for manufacturing the same Grant 8,461,940 - Takada , et al. June 11, 2 | 2013-06-11 |
Surface acoustic wave device Grant 8,072,118 - Omote , et al. December 6, 2 | 2011-12-06 |
Surface acoustic wave device Grant 7,944,125 - Takada , et al. May 17, 2 | 2011-05-17 |
Surface Acoustic Wave Device App 20100327694 - OMOTE; Ryoichi ;   et al. | 2010-12-30 |
Elastic Wave Device And Method For Manufacturing The Same App 20100289600 - TAKADA; Norihiko ;   et al. | 2010-11-18 |
Surface Acoustic Wave Device And Manufacturing Method Thereof App 20100253182 - TAKADA; Norihiko ;   et al. | 2010-10-07 |
Surface acoustic wave device having excellent balancing characteristics between balanced terminals and a communication device using the same Grant 6,940,369 - Nakahashi , et al. September 6, 2 | 2005-09-06 |
Facility reservation system, facility reservation apparatus, and facility reservation method App 20040260580 - Takada, Norihiko | 2004-12-23 |
Electronic part Grant 6,815,834 - Shimoe , et al. November 9, 2 | 2004-11-09 |
Wire bonding method Grant 6,757,946 - Takada , et al. July 6, 2 | 2004-07-06 |
Surface acoustic wave device and communication device App 20040012465 - Nakahashi, Norihiko ;   et al. | 2004-01-22 |
Electronic part App 20030160334 - Shimoe, Kazunobu ;   et al. | 2003-08-28 |
Method of producing surface acoustic wave device Grant 6,557,225 - Takata , et al. May 6, 2 | 2003-05-06 |
Method of producing surface acoustic wave device App 20010029650 - Takata, Toshiaki ;   et al. | 2001-10-18 |
Wire bonding method, surface acoustic wave apparatus and method for producing surface acoustic wave apparatus App 20010022484 - Takada, Norihiko ;   et al. | 2001-09-20 |
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