loadpatents
name:-0.020347833633423
name:-0.03157377243042
name:-0.0066149234771729
Tajima; Hidekazu Patent Filings

Tajima; Hidekazu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tajima; Hidekazu.The latest application filed is for "detergent for lithography and method of forming resist pattern with the same".

Company Profile
0.6.7
  • Tajima; Hidekazu - Kawasaki N/A JP
  • Tajima; Hidekazu - Kawasaki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Detergent for lithography and method of forming resist pattern with the same
Grant 8,367,312 - Sawada , et al. February 5, 2
2013-02-05
Lithographic rinse solution and method for forming patterned resist layer using the same
Grant 7,897,325 - Sawada , et al. March 1, 2
2011-03-01
Resist pattern forming method and composite rinse agent
Grant 7,811,748 - Koshiyama , et al. October 12, 2
2010-10-12
Cleaning liquid for lithography and method for resist pattern formation
Grant 7,795,197 - Sawada , et al. September 14, 2
2010-09-14
Rinsing fluid for lithography
Grant 7,741,260 - Koshiyama , et al. June 22, 2
2010-06-22
Detergent For Lithography And Method Of Forming Resist Pattern With The Same
App 20090004608 - Sawada; Yoshihiro ;   et al.
2009-01-01
Rinsing Liquid for Lithography and Method for Resist Pattern Formation
App 20080193876 - Sawada; Yoshihiro ;   et al.
2008-08-14
Cleaning Liquid For Lithography And Method For Resist Pattern Formation
App 20080096141 - Sawada; Yoshihiro ;   et al.
2008-04-24
Rinsing Fluid for Lithography
App 20080026975 - Koshiyama; Jun ;   et al.
2008-01-31
Rinse Solution For Lithography
App 20070218412 - Koshiyama; Jun ;   et al.
2007-09-20
Resist Pattern Forming Method and Composite Rinse Agent
App 20070218399 - Koshiyama; Jun ;   et al.
2007-09-20
Lithographic rinse solution and method for forming patterned resist layer using the same
App 20060128581 - Sawada; Yoshihiro ;   et al.
2006-06-15

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