TAIWAN SOLUTIONS SYSTEMS CORP.
Patent Applications and Registrations
Patent applications and USPTO patent grants for TAIWAN SOLUTIONS SYSTEMS CORP..The latest application filed is for "light-emitting diode module and manufacturing method thereof".
- TAIWAN SOLUTIONS SYSTEMS CORP. - HSINCHU CITY TW
- Taiwan Solutions Systems Corp. -
- Taiwan Solutions Systems Corp. - Hsin-Chu TW
| Patent | Date |
|---|---|
| Light-emitting Diode Module And Manufacturing Method Thereof App 20110121339 - WU; CHIA-MIN | 2011-05-26 |
| Light Emitting Diode Module And Manufacture Method Thereof App 20100301365 - CHUANG; BILL ; et al. | 2010-12-02 |
| Chip Package Carrier And Fabrication Method Thereof App 20090294952 - Lin; Chi Chih ; et al. | 2009-12-03 |
| Chip Package Structure And Its Fabrication Method App 20090108444 - CHUANG; BILL | 2009-04-30 |
| Chip package substrate and structure thereof App 20080217759 - Lin; Chi Chih ; et al. | 2008-09-11 |
| Fabrication method for a chip packaging structure Grant 7,320,901 - Chang January 22, 2 | 2008-01-22 |
| Method for fabricating chip package structure App 20070228541 - Lin; Chi Chih ; et al. | 2007-10-04 |
| Substrate of chip package and chip package structure thereof App 20070194430 - Lin; Chi Chih ; et al. | 2007-08-23 |
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