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Patent applications and USPTO patent grants for Taiwan Semiconductor Manufactuirng Company.The latest application filed is for "copper process compatible cmos metal-insulator-metal capacitor structure and its process flow".
Patent | Date |
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Copper process compatible CMOS metal-insulator-metal capacitor structure and its process flow Grant 6,329,234 - Ma , et al. December 11, 2 | 2001-12-11 |
Dual damascene process for carbon-based low-K materials Grant 6,211,061 - Chen , et al. April 3, 2 | 2001-04-03 |
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