Tai; Yung-Wei
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tai; Yung-Wei.The latest application filed is for "horizontal computer mounting arrangement".
- Tai; Yung-Wei - Taipei TW
- Tai, Yung-Wei - Taipei City TW
- Tai; Yung-Wei - Osaka JP
- Tai; Yung-Wei - Cincinnati OH
- Tai; Yung-Wei - Kobe JP
| Patent | Date |
|---|---|
| Horizontal computer mounting arrangement Grant 7,123,470 - Hsu , et al. October 17, 2 | 2006-10-17 |
| Horizontal computer mounting arrangement App 20050276004 - Hsu, Ming-Chun ; et al. | 2005-12-15 |
| Non-continuous absorbent cores comprising a porous macrostructure of absorbent gelling particles Grant 5,868,724 - Dierckes, Jr. , et al. February 9, 1 | 1999-02-09 |
| Non-continuous absorbent composites comprising a porous macrostructure of absorbent gelling particles and a substrate Grant 5,713,881 - Rezai , et al. February 3, 1 | 1998-02-03 |
| Absorbent composites comprising a porous macrostructure of absorbent gelling particles and a substrate Grant 5,536,264 - Hsueh , et al. July 16, 1 | 1996-07-16 |
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