Tai; Wen-Chuan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tai; Wen-Chuan.The latest application filed is for "piezoelectric anti-stiction structure for microelectromechanical systems".

Company Profile

23.45.44

Tai; Wen-Chuan - Hsinchu City TW
Tai; Wen-Chuan - Hsinchu TW
Tai; Wen-Chuan - Dayuan Township TW
Tai; Wen-Chuan - Dayuan Township, Taoyuan County N/A TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Piezoelectric Anti-stiction Structure For Microelectromechanical Systems App 20220306452 - Hu; Fan ; et al.	2022-09-29
Piezoelectric anti-stiction structure for microelectromechanical systems Grant 11,365,115 - Hu , et al. June 21, 2	2022-06-21
Reduction of electric field enhanced moisture penetration by metal shielding Grant 11,289,568 - Shih , et al. March 29, 2	2022-03-29
MEMS device Grant 11,220,422 - Hu , et al. January 11, 2	2022-01-11
Biosensor System with Integrated Microneedle App 20210239688 - Chang; Allen Timothy ; et al.	2021-08-05
Wafer-level Packaging of Solid-state Biosensor, Microfluidics, and Through-Silicon Via App 20210239647 - Chang; Allen Timothy ; et al.	2021-08-05
Semiconductor arrangement and formation thereof Grant 10,981,781 - Huang , et al. April 20, 2	2021-04-20
Wafer level integrated MEMS device enabled by silicon pillar and smart cap Grant 10,961,118 - Lee , et al. March 30, 2	2021-03-30
Method For Forming Multi-depth Mems Package App 20210078858 - Tai; Wen-Chuan ; et al.	2021-03-18
Piezoelectric Anti-stiction Structure For Microelectromechanical Systems App 20210061641 - Hu; Fan ; et al.	2021-03-04
Wafer level integrated MEMS device enabled by silicon pillar and smart cap Grant 10,899,608 - Lee , et al. January 26, 2	2021-01-26
Multi-depth MEMS package Grant 10,865,102 - Tai , et al. December 15, 2	2020-12-15
Method For Forming Multi-depth Mems Package App 20200346923 - Tai; Wen-Chuan ; et al.	2020-11-05
Mems Device App 20200290863 - HU; FAN ; et al.	2020-09-17
Method for forming multi-depth MEMS package Grant 10,752,495 - Tai , et al. A	2020-08-25
MEMS structure with bilayer stopper and method for forming the same Grant 10,618,801 - Tai , et al.	2020-04-14
Method For Forming Multi-depth Mems Package App 20200109046 - Tai; Wen-Chuan ; et al.	2020-04-09
Semiconductor Arrangement And Formation Thereof App 20200062587 - Huang; Hsin-Ting ; et al.	2020-02-27
Method for forming multi-depth MEMS package Grant 10,556,790 - Tai , et al. Feb	2020-02-11
Wafer level integrated MEMS device enabled by silicon pillar and smart cap Grant 10,556,792 - Lee , et al. Feb	2020-02-11
Wafer Level Integrated Mems Device Enabled By Silicon Pillar And Smart Cap App 20200024136 - Lee; Yi-Chia ; et al.	2020-01-23
Wafer Level Integrated Mems Device Enabled By Silicon Pillar And Smart Cap App 20200024137 - Lee; Yi-Chia ; et al.	2020-01-23
Reduction Of Electric Field Enhanced Moisture Penetration By Metal Shielding App 20200006469 - Shih; Chi-Yuan ; et al.	2020-01-02
Semiconductor arrangement and formation thereof Grant 10,464,808 - Huang , et al. No	2019-11-05
Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity Grant 10,392,244 - Hung , et al. A	2019-08-27
Method For Forming Multi-depth Mems Package App 20190161342 - Tai; Wen-Chuan ; et al.	2019-05-30
Wafer Level Integrated Mems Device Enabled By Silicon Pillar And Smart Cap App 20190161346 - Lee; Yi-Chia ; et al.	2019-05-30
Apparatus and method of manufacturing for combo MEMS device accommodating different working pressures Grant 10,266,399 - Lee , et al.	2019-04-23
MEMS device with enhanced sensing structure and manufacturing method thereof Grant 10,266,396 - Shen , et al.	2019-04-23
Apparatus And Method Of Manufacturing For Combo Mems Device Accommodating Different Working Pressures App 20190062156 - LEE; JIOU-KANG ; et al.	2019-02-28
Mems Device With Enhanced Sensing Structure And Manufacturing Method Thereof App 20180339899 - SHEN; CHING-KAI ; et al.	2018-11-29
Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications Grant 10,131,540 - Yu , et al. November 20, 2	2018-11-20
Method of selectively removing an anti-stiction layer on a eutectic bonding area Grant 10,053,361 - Hsieh , et al. August 21, 2	2018-08-21
Mems Structure With Bilayer Stopper And Method For Forming The Same App 20180127263 - TAI; Wen-Chuan ; et al.	2018-05-10
Semiconductor Arrangement And Formation Thereof App 20180022602 - Huang; Hsin-Ting ; et al.	2018-01-25
Microelectromechanical systems (MEMS) devices at different pressures Grant 9,856,139 - Huang , et al. January 2, 2	2018-01-02
Monolithic MEMS platform for integrated pressure, temperature, and gas sensor Grant 9,845,236 - Yu , et al. December 19, 2	2017-12-19
Semiconductor arrangement and formation thereof Grant 9,776,858 - Huang , et al. October 3, 2	2017-10-03
Microelectromechanical Systems (mems) Devices At Different Pressures App 20170233249 - Huang; Hsin-Ting ; et al.	2017-08-17
Thin film structure for hermetic sealing Grant 9,714,166 - Yu , et al. July 25, 2	2017-07-25
Microelectromechanical systems (MEMS) devices at different pressures Grant 9,656,857 - Huang , et al. May 23, 2	2017-05-23
Method For Sealing A Cavity Of A Microelectromechanical Systems (mems) Device Using A Seal Layer Covering Or Lining A Hole In Fluid Communication With The Cavity App 20170121174 - Hung; Chia-Ming ; et al.	2017-05-04
Semiconductor device and method of manufacturing Grant 9,630,832 - Lin , et al. April 25, 2	2017-04-25
Energy-harvesting device Grant 9,584,003 - Chung , et al. February 28, 2	2017-02-28
Microelectrochemical systems (MEMS) device having a seal layer arranged over or lining a hole in fluid communication with a cavity of the MEMS device Grant 9,567,204 - Hung , et al. February 14, 2	2017-02-14
Monolithic Mems Platform For Integrated Pressure, Temperature, And Gas Sensor App 20160266061 - Yu; Shao-Chi ; et al.	2016-09-15
Structure And Method To Mitigate Soldering Offset For Wafer-level Chip Scale Package (wlcsp) Applications App 20160264402 - Yu; Shao-Chi ; et al.	2016-09-15
Semiconductor device and manufacturing method thereof Grant 9,422,151 - Tai , et al. August 23, 2	2016-08-23
Method of Selectively Removing an Anti-Stiction Layer on a Eutectic Bonding Area App 20160185592 - Hsieh; Yuan-Chih ; et al.	2016-06-30
Structure and method for motion sensor Grant 9,365,416 - Shu , et al. June 14, 2	2016-06-14
Microelectromechanical Systems (mems) Devices At Different Pressures App 20160130137 - Huang; Hsin-Ting ; et al.	2016-05-12
Energy-harvesting Device App 20160126819 - CHUNG; Tien-Kan ; et al.	2016-05-05
High Vacuum Sealing for Sensor Platform Process App 20160060103 - Hung; Chia-Ming ; et al.	2016-03-03
Micro-electro mechanical system (MEMS) structures and methods of forming the same Grant 9,266,714 - Shu , et al. February 23, 2	2016-02-23
Energy-harvesting device and method of forming the same Grant 9,246,401 - Chung , et al. January 26, 2	2016-01-26
Thin Film Structure For Hermetic Sealing App 20160016789 - Yu; Shao-Chi ; et al.	2016-01-21
Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV) Grant 9,202,792 - Yu , et al. December 1, 2	2015-12-01
Structure And Method Of Providing A Re-distribution Layer (rdl) And A Through-silicon Via (tsv) App 20150311168 - YU; SHAO-CHI ; et al.	2015-10-29
Semiconductor Arrangement And Formation Thereof App 20150239732 - Huang; Hsin-Ting ; et al.	2015-08-27
Semiconductor Device And Method Of Manufacturing App 20150175406 - LIN; Chin-Min ; et al.	2015-06-25
Energy-harvesting Device And Method Of Forming The Same App 20150091636 - CHUNG; Tien-Kan ; et al.	2015-04-02
Sensor with energy-harvesting device Grant 8,928,162 - Chung , et al. January 6, 2	2015-01-06
Electrical bypass structure for MEMS device Grant 8,878,312 - Hung , et al. November 4, 2	2014-11-04
Sensor With Energy-harvesting Device App 20140208580 - CHUNG; Tien-Kan ; et al.	2014-07-31
Micro-electro Mechanical System (mems) Structures And Methods Of Forming The Same App 20140203421 - SHU; Chia-Pao ; et al.	2014-07-24
Method of manufacturing a MEMS device Grant 8,763,220 - Chung , et al. July 1, 2	2014-07-01
Hybrid MEMS bump design to prevent in-process and in-use stiction Grant 8,723,280 - Shu , et al. May 13, 2	2014-05-13
Sensor with energy-harvesting device Grant 8,723,343 - Chung , et al. May 13, 2	2014-05-13
Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the same Grant 8,716,852 - Shu , et al. May 6, 2	2014-05-06
Inline process control structures Grant 8,647,892 - Liang , et al. February 11, 2	2014-02-11
Hybrid Mems Bump Design To Prevent In-process And In-use Stiction App 20140035072 - Shu; Chia-Pao ; et al.	2014-02-06
Micro-electro Mechanical Systems (mems) Structures And Methods Of Forming The Same App 20130214400 - SHU; Chia-Pao ; et al.	2013-08-22
Mems Kinetic Energy Conversion App 20130147317 - Chung; Tien-Kan ; et al.	2013-06-13
MEMS kinetic energy conversion Grant 8,410,665 - Chung , et al. April 2, 2	2013-04-02
Structure And Method For Motion Sensor App 20130043510 - Shu; Chia-Pao ; et al.	2013-02-21
Sensor With Energy-harvesting Device App 20120235647 - CHUNG; Tien-Kan ; et al.	2012-09-20
Electrical Bypass Structure For Mems Device App 20120223613 - Hung; Chia-Ming ; et al.	2012-09-06
Mems Kinetic Energy Conversion App 20120161582 - CHUNG; TIEN-KAN ; et al.	2012-06-28
Inline Process Control Structures App 20120091454 - Liang; Kai-Chih ; et al.	2012-04-19

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