Tai; Wei-Chang
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tai; Wei-Chang.The latest application filed is for "substrate structure having a solder mask and a process for making the same".
- Tai; Wei-Chang - Kaohsiung TW
- Tai; Wei-Chang - Kao-Hsiung TW
- Tai; Wei-Chang - Kao-Hsiung City TW
- Tai; Wei-Chang - Kaoshiung TW
- Tai, Wei-Chang - Kaohsiung City TW
| Patent | Date |
|---|---|
| Substrate structure having a solder mask and a process for making the same Grant 7,473,629 - Tai , et al. January 6, 2 | 2009-01-06 |
| System-in-package structure Grant 7,417,329 - Chuang , et al. August 26, 2 | 2008-08-26 |
| Substrate structure having a solder mask and a process for making the same App 20070243704 - Tai; Wei-Chang ; et al. | 2007-10-18 |
| System-in-package Structure App 20070132093 - Chuang; Meng-Jung ; et al. | 2007-06-14 |
| Die package and method for making the same App 20070072341 - Tai; Wei-Chang ; et al. | 2007-03-29 |
| Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units Grant 7,195,956 - Weng , et al. March 27, 2 | 2007-03-27 |
| Mesh shaped dam mounted on a substrate Grant 7,180,181 - Liu , et al. February 20, 2 | 2007-02-20 |
| Method for stacking BGA packages and structure from the same App 20060110849 - Lee; Cheng-Yin ; et al. | 2006-05-25 |
| Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units App 20050266616 - Weng, Gwo-Liang ; et al. | 2005-12-01 |
| Semiconductor Package Module And Manufacturing Method Thereof App 20050181543 - Lee, Shih-Chang ; et al. | 2005-08-18 |
| Substrate with mesh App 20050082680 - Liu, Pai-Chou ; et al. | 2005-04-21 |
| Flip chip package Grant 6,815,833 - Lee , et al. November 9, 2 | 2004-11-09 |
| [semiconductor Package Module And Manufacturing Mehod Thereof] App 20040113266 - LEE, SHIH-CHANG ; et al. | 2004-06-17 |
| Flip chip package App 20040089879 - Lee, Shih-Chang ; et al. | 2004-05-13 |
| System in package structure App 20040080036 - Chang, Ching-Hui ; et al. | 2004-04-29 |
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