Tai; King Lien
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tai; King Lien.The latest application filed is for "integrated passive devices".
- Tai; King Lien - Berkeley Heights NJ
| Patent | Date |
|---|---|
| Integrated passive devices App 20090218655 - Degani; Yinon ; et al. | 2009-09-03 |
| Integrated passive devices App 20070262418 - Degani; Yinon ; et al. | 2007-11-15 |
| Integrated passive devices Grant 7,259,077 - Degani , et al. August 21, 2 | 2007-08-21 |
| Cellular/Wi-Fi combination devices App 20060217102 - Degani; Yinon ; et al. | 2006-09-28 |
| High frequency integrated circuits App 20060197182 - Degani; Yinon ; et al. | 2006-09-07 |
| Testing integrated circuits Grant 7,061,258 - Degani , et al. June 13, 2 | 2006-06-13 |
| Integrated passive devices App 20050253255 - Degani, Yinon ; et al. | 2005-11-17 |
| Testing integrated circuits App 20050088194 - Degani, Yinon ; et al. | 2005-04-28 |
| Membrane test method and apparatus for integrated circuit testing Grant 6,867,607 - Degani , et al. March 15, 2 | 2005-03-15 |
| High frequency integrated circuits App 20040075170 - Degani, Yinon ; et al. | 2004-04-22 |
| Air isolated crossovers Grant 6,683,384 - Kossives , et al. January 27, 2 | 2004-01-27 |
| Method of testing and constructing monolithic multi-chip modules Grant 6,680,212 - Degani , et al. January 20, 2 | 2004-01-20 |
| High performance multi-chip IC package Grant 6,678,167 - Degani , et al. January 13, 2 | 2004-01-13 |
| Testing integrated circuits App 20030137315 - Degani, Yinon ; et al. | 2003-07-24 |
| Multi-chip ball grid array IC packages Grant 6,437,990 - Degani , et al. August 20, 2 | 2002-08-20 |
| Packaging micromechanical devices Grant 6,433,411 - Degani , et al. August 13, 2 | 2002-08-13 |
| Method of testing and constructing monolithic multi-chip modules App 20020081755 - Degani, Yinon ; et al. | 2002-06-27 |
| Interconnecting micromechanical devices Grant 6,396,711 - Degani , et al. May 28, 2 | 2002-05-28 |
| Packaging silicon on silicon multichip modules Grant 6,369,444 - Degani , et al. April 9, 2 | 2002-04-09 |
| Circuit and method for providing interconnections among individual integrated circuit chips in a multi-chip module App 20010030361 - Gabara, Thaddeus John ; et al. | 2001-10-18 |
| Low profile integrated circuit packages Grant 6,251,705 - Degani , et al. June 26, 2 | 2001-06-26 |
| Interposer for recessed flip-chip package Grant 6,175,158 - Degani , et al. January 16, 2 | 2001-01-16 |
| Solder bonding printed circuit boards Grant 6,100,475 - Degani , et al. August 8, 2 | 2000-08-08 |
| MCM with high Q overlapping resonator Grant 6,075,427 - Tai , et al. June 13, 2 | 2000-06-13 |
| Self-contained memory apparatus having diverse types of memory and distributed control Grant 6,029,224 - Asthana , et al. February 22, 2 | 2000-02-22 |
| Solder bonding printed circuit boards Grant 6,013,877 - Degani , et al. January 11, 2 | 2000-01-11 |
| Thin film tantalum oxide capacitors and resulting product Grant 5,936,831 - Kola , et al. August 10, 1 | 1999-08-10 |
| RF IC package Grant 5,869,894 - Degani , et al. February 9, 1 | 1999-02-09 |
| Method and apparatus for forming fine patterns on printed circuit board Grant 5,834,160 - Ferry , et al. November 10, 1 | 1998-11-10 |
| Multi-chip modules with isolated coupling between modules Grant 5,747,982 - Dromgoole , et al. May 5, 1 | 1998-05-05 |
| Curbside circuitry for interactive communication services Grant 5,699,105 - Chen , et al. December 16, 1 | 1997-12-16 |
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