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Patent applications and USPTO patent grants for Tai; Enyong.The latest application filed is for "overlapping die stacks for nand package architecture".
Patent | Date |
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Overlapping Die Stacks For Nand Package Architecture App 20220271007 - Tai; Enyong ;   et al. | 2022-08-25 |
Overlapping die stacks for NAND package architecture Grant 11,309,281 - Tai , et al. April 19, 2 | 2022-04-19 |
Overlapping Die Stacks For Nand Package Architecture App 20220068877 - Tai; Enyong ;   et al. | 2022-03-03 |
Semiconductor device including independent film layer for embedding and/or spacing semiconductor die Grant 9,773,766 - Ye , et al. September 26, 2 | 2017-09-26 |
Semiconductor Device Including Independent Film Layer For Embedding And/or Spacing Semiconductor Die App 20150221624 - Ye; Ning ;   et al. | 2015-08-06 |
Solder Pillars For Embedding Semiconductor Die App 20150187745 - Chiu; Chin-Tien ;   et al. | 2015-07-02 |
Non-uniform vacuum profile die attach tip Grant 9,038,264 - Rai , et al. May 26, 2 | 2015-05-26 |
Non-uniform Vacuum Profile Die Attach Tip App 20120216396 - Rai; Pradeep Kumar ;   et al. | 2012-08-30 |
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