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Patent applications and USPTO patent grants for Tai; Chia-Ming.The latest application filed is for "mechanisms for cleaning wafer and scrubber".
Patent | Date |
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Mechanisms for cleaning wafer and scrubber Grant 9,478,444 - Lyu , et al. October 25, 2 | 2016-10-25 |
Thin film deposition apparatus with multi chamber design and film deposition methods Grant 9,324,559 - Wang , et al. April 26, 2 | 2016-04-26 |
Mechanisms For Cleaning Wafer And Scrubber App 20150027489 - LYU; Tai-Liang ;   et al. | 2015-01-29 |
Thin Film Deposition Apparatus With Multi Chamber Design And Film Deposition Methods App 20140377961 - Wang; Lan Hai ;   et al. | 2014-12-25 |
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