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Mold for resin sealing a semiconductor chip, and semiconductor device having resin-sealed semiconductor chip Grant 10,850,334 - Taguchi December 1, 2 | 2020-12-01 |
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Resin-encapsulated semiconductor device Grant 10,658,275 - Taguchi | 2020-05-19 |
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Semiconductor Device And Method Of Manufacturing The Same App 20190371713 - TAGUCHI; Yasuhiro | 2019-12-05 |
Manufacturing method for semiconductor device Grant 10,381,245 - Taguchi A | 2019-08-13 |
Resin Encapsulating Mold And Method Of Manufacturing Semiconductor Device App 20190148173 - TAGUCHI; Yasuhiro | 2019-05-16 |
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Semiconductor device having plated outer leads exposed from encapsulating resin Grant 10,109,561 - Taguchi October 23, 2 | 2018-10-23 |
Semiconductor Device App 20180269165 - TAGUCHI; Yasuhiro | 2018-09-20 |
Method of manufacturing semiconductor device having semiconductor chip mounted on lead frame Grant 10,043,721 - Taguchi August 7, 2 | 2018-08-07 |
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Method Of Manufacturing Semiconductor Device Having Semiconductor Chip Mounted On Lead Frame App 20170229355 - TAGUCHI; Yasuhiro | 2017-08-10 |
Resin-encapsulated Semiconductor Device App 20170221804 - TAGUCHI; Yasuhiro | 2017-08-03 |
Semiconductor device having semiconductor chip mounted on lead frame Grant 9,698,064 - Taguchi July 4, 2 | 2017-07-04 |
Liquid Ejection System App 20170144446 - IGARASHI; HITOSHI ;   et al. | 2017-05-25 |
Mold For Resin Sealing, Manufacturing Method Therefor, And Semiconductor Device App 20160172316 - TAGUCHI; Yasuhiro | 2016-06-16 |
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