TAGUCHI; Toshihiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for TAGUCHI; Toshihiko.The latest application filed is for "soldering alloy and solder joint".
- TAGUCHI; Toshihiko - Adachi-ku Tokyo
- Taguchi; Toshihiko - Tokyo JP
- Taguchi; Toshihiko - Saitama JP
- Taguchi; Toshihiko - Kitakatsushika-gun JP
- Taguchi; Toshihiko - Showa JA
| Patent | Date |
|---|---|
| Soldering Alloy And Solder Joint App 20200384577 - SAKAMOTO; Takeshi ; et al. | 2020-12-10 |
| Lead-free solder Grant 8,220,692 - Ohnishi , et al. July 17, 2 | 2012-07-17 |
| Lead-free Solder App 20110089224 - Ohnishi; Tsukasa ; et al. | 2011-04-21 |
| Solder paste and printed circuit board Grant 7,681,777 - Hirata , et al. March 23, 2 | 2010-03-23 |
| Lead-free solder and soldered article Grant 7,282,174 - Hirata , et al. October 16, 2 | 2007-10-16 |
| Solder paste and printed board App 20060261131 - Hirata; Masahiko ; et al. | 2006-11-23 |
| Lead-free solder and soldered article App 20060102690 - Hirata; Masahiko ; et al. | 2006-05-18 |
| Solder paste Grant 6,926,849 - Taguchi , et al. August 9, 2 | 2005-08-09 |
| Lead-free solder paste for reflow soldering Grant 6,896,172 - Taguchi , et al. May 24, 2 | 2005-05-24 |
| Lead-free solder paste for reflow soldering App 20040217152 - Taguchi, Toshihiko ; et al. | 2004-11-04 |
| Solder paste Grant 6,736,907 - Taguchi , et al. May 18, 2 | 2004-05-18 |
| Solder pastes App 20040069974 - Taguchi, Toshihiko ; et al. | 2004-04-15 |
| Solder paste App 20030121564 - Taguchi, Toshihiko ; et al. | 2003-07-03 |
| Lead-free solder alloys App 20030021719 - Taguchi, Toshihiko ; et al. | 2003-01-30 |
| Thermosetting soldering flux and soldering process Grant 6,402,013 - Abe , et al. June 11, 2 | 2002-06-11 |
| Lead-free Zinc-Containing Solder Paste App 20020050305 - Taguchi, Toshihiko ; et al. | 2002-05-02 |
| Lead-free solder alloys App 20020015660 - Murata, Toshikazu ; et al. | 2002-02-07 |
| Thermosetting soldering flux and soldering process App 20010019075 - Abe, Hisayuki ; et al. | 2001-09-06 |
| Lead-free solder alloys Grant 6,241,942 - Murata , et al. June 5, 2 | 2001-06-05 |
| Solder paste Grant 6,159,304 - Noguchi , et al. December 12, 2 | 2000-12-12 |
| Paste solder with minimized residue Grant 5,176,759 - Taguchi January 5, 1 | 1993-01-05 |
| Water-soluble soldering flux and paste solder using the flux Grant 4,988,395 - Taguchi , et al. January 29, 1 | 1991-01-29 |
| Microsphere of solder having a metallic core and production thereof Grant 4,097,266 - Takahashi , et al. June 27, 1 | 1978-06-27 |
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