| Patent | Date |
|---|
Ultraviolet irradiation head and ultraviolet irradiator
Grant 9,190,591 - Tahara , et al. November 17, 2 | 2015-11-17 |
Ultraviolet Irradiation Head And Ultraviolet Irradiator
App 20150221844 - Tahara; Akihiro ; et al. | 2015-08-06 |
Plasma Treatment Apparatus
App 20100147464 - Shibata; Tetsuji ; et al. | 2010-06-17 |
Plasma processing apparatus, method for producing reaction vessel for plasma generation, and plasma processing method
Grant 7,543,546 - Shibata , et al. June 9, 2 | 2009-06-09 |
Hollow carbon fiber and production method
Grant 7,273,652 - Takeda , et al. September 25, 2 | 2007-09-25 |
Electromagnetic wave absorption material and an associated device
Grant 7,239,261 - Fujieda , et al. July 3, 2 | 2007-07-03 |
Fabrication process of semiconductor package and semiconductor package
Grant 7,187,072 - Fukutomi , et al. March 6, 2 | 2007-03-06 |
Plasma treatment apparatus, method of producing reaction vessel for plasma generation, and plasma treatment method
App 20060042545 - Shibata; Tetsuji ; et al. | 2006-03-02 |
Electromagnetic wave absorption material and an associated device
App 20050035896 - Fujieda, Tadashi ; et al. | 2005-02-17 |
Plasma processing device and plasma processing method
App 20050016456 - Taguchi, Noriyuki ; et al. | 2005-01-27 |
Electromagnetic wave absorption material and an associated device
Grant 6,818,821 - Fujieda , et al. November 16, 2 | 2004-11-16 |
Electromagnetic wave absorption material and an associated device
App 20040146452 - Fujieda, Tadashi ; et al. | 2004-07-29 |
Fabrication process of semiconductor package and semiconductor package
App 20040110319 - Fukutomi, Naoki ; et al. | 2004-06-10 |
Fabrication process of semiconductor package and semiconductor package
Grant 6,746,897 - Fukutomi , et al. June 8, 2 | 2004-06-08 |
Hollow carbon fiber and production method
Grant 6,743,500 - Takeda , et al. June 1, 2 | 2004-06-01 |
Plasma treatment apparatus and plasma treatment method
Grant 6,670,766 - Yamazaki , et al. December 30, 2 | 2003-12-30 |
Hollow carbon fiber and production method
Grant 6,641,792 - Takeda , et al. November 4, 2 | 2003-11-04 |
Electromagnetic wave absorption material and an associated device
App 20030155143 - Fujieda, Tadashi ; et al. | 2003-08-21 |
Hollow carbon fiber and production method
App 20030039829 - Takeda, Shinji ; et al. | 2003-02-27 |
Hollow carbon fiber and production method
App 20030039830 - Takeda, Shinji ; et al. | 2003-02-27 |
Hollow carbon fiber and production method
App 20030026980 - Takeda, Shinji ; et al. | 2003-02-06 |
Plasma treatment apparatus and plasma generation method using the apparatus
Grant 6,465,964 - Taguchi , et al. October 15, 2 | 2002-10-15 |
Fabrication process of semiconductor package and semiconductor package
App 20020094606 - Fukutomi, Naoki ; et al. | 2002-07-18 |
Fabrication process of semiconductor package and semiconductor package
App 20020039808 - Fukutomi, Naoki ; et al. | 2002-04-04 |
Plasma treatment apparatus and plasma treatment method
App 20020008480 - Yamazaki, Keiichi ; et al. | 2002-01-24 |
Fabrication process of semiconductor package and semiconductor package
Grant 5,976,912 - Fukutomi , et al. November 2, 1 | 1999-11-02 |
Rear projection screen and manufacturing method therefor as well as molding die for shaping rear projection screen, overhead projector and projection television set
Grant 5,166,824 - Nishiguchi , et al. November 24, 1 | 1992-11-24 |
Ceramic wiring boards
Grant 4,465,727 - Fujita , et al. August 14, 1 | 1984-08-14 |
Ceramic multilayer circuit board and a process for manufacturing the same
Grant 4,464,420 - Taguchi , et al. August 7, 1 | 1984-08-07 |
Low temperature-sinterable dielectric composition and thick film capacitor using the same
Grant 4,308,571 - Tanei , et al. December 29, 1 | 1981-12-29 |
Dielectric paste for thick film capacitor
Grant 4,220,547 - Abe , et al. September 2, 1 | 1980-09-02 |
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