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name:-0.01385498046875
name:-0.007875919342041
name:-0.0015320777893066
Tagawa; Seiichi Patent Filings

Tagawa; Seiichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tagawa; Seiichi.The latest application filed is for "resist pattern formation method".

Company Profile
1.12.16
  • Tagawa; Seiichi - Suita JP
  • TAGAWA; Seiichi - Suita-shi JP
  • Tagawa; Seiichi - Osaka JP
  • Tagawa; Seiichi - Ageo JP
  • Tagawa; Seiichi - Saitama JP
  • Tagawa, Seiichi - Ageo-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Resist patterning method and resist material
Grant 11,187,984 - Tagawa November 30, 2
2021-11-30
Resist Pattern Formation Method
App 20210216016 - TAGAWA; Seiichi
2021-07-15
Resist patterning method, latent resist image forming device, resist patterning device, and resist material
Grant 10,670,967 - Tagawa , et al.
2020-06-02
Photo-sensitized chemically amplified resist (PS-CAR) simulation
Grant 10,429,745 - Carcasi , et al. O
2019-10-01
Resist Patterning Method And Resist Material
App 20180356731 - TAGAWA; Seiichi
2018-12-13
Chemically amplified resist material, pattern-forming method, compound, and production method of compound
Grant 10,073,349 - Nakagawa , et al. September 11, 2
2018-09-11
Resist-pattern-forming method and chemically amplified resist material
Grant 10,073,348 - Nakagawa , et al. September 11, 2
2018-09-11
Resist Patterning Method, Latent Resist Image Forming Device, Resist Patterning Device, And Resist Material
App 20180231892 - TAGAWA; Seiichi ;   et al.
2018-08-16
Substrate treatment system
Grant 10,025,190 - Nagahara , et al. July 17, 2
2018-07-17
Photosensitization chemical-amplification type resist material, method for forming pattern using same, semiconductor device, mask for lithography, and template for nanoimprinting
Grant 10,025,187 - Nagahara , et al. July 17, 2
2018-07-17
Resist patterning method, latent resist image forming device, resist patterning device, and resist material
Grant 9,977,332 - Tagawa , et al. May 22, 2
2018-05-22
Pattern-forming method
Grant 9,971,247 - Nakagawa , et al. May 15, 2
2018-05-15
Photo-sensitized Chemically Amplified Resist (PS-CAR) simulation
App 20170242342 - Carcasi; Michael ;   et al.
2017-08-24
Resist Patterning Method, Latent Resist Image Forming Device, And Resist Material
App 20170097570 - TAGAWA; Seiichi
2017-04-06
Pattern-forming Method
App 20170052450 - NAKAGAWA; Hisashi ;   et al.
2017-02-23
Chemically Amplified Resist Material, Pattern-forming Method, Compound, And Production Method Of Compound
App 20170052449 - NAKAGAWA; HISASHI ;   et al.
2017-02-23
Resist-pattern-forming Method And Chemically Amplified Resist Material
App 20170052448 - NAKAGAWA; Hisashi ;   et al.
2017-02-23
Substrate Treatment System
App 20170031245 - NAGAHARA; Seiji ;   et al.
2017-02-02
Photosensitization Chemical-amplification Type Resist Material, Method For Forming Pattern Using Same, Semiconductor Device, Mask For Lithography, And Template For Nanoimprinting
App 20160357103 - NAGAHARA; Seiji ;   et al.
2016-12-08
Microstructural Materials And Fabrication Method Thereof
App 20160193756 - OSHIMA; Akihiro ;   et al.
2016-07-07
Resist Patterning Method, Latent Resist Image Forming Device, Resist Patterning Device, And Resist Material
App 20160004160 - TAGAWA; Seiichi ;   et al.
2016-01-07
Microstructural Materials And Fabrication Method Thereof
App 20120231220 - Oshima; Akihiro ;   et al.
2012-09-13
Ceramic nanowires and a process for producing them by ion beam irradiation
Grant 7,731,927 - Sugimoto , et al. June 8, 2
2010-06-08
Ceramic Nanowires And A Process For Producing Them By Ion Beam Irradiation
App 20100111805 - Sugimoto; Masaki ;   et al.
2010-05-06
Damper and process thereof
Grant 7,354,637 - Tagawa , et al. April 8, 2
2008-04-08
Damper and process thereof
Grant 6,984,432 - Tagawa , et al. January 10, 2
2006-01-10
Damper and process thereof
App 20050250584 - Tagawa, Seiichi ;   et al.
2005-11-10
Damper and process thereof
App 20030035966 - Tagawa, Seiichi ;   et al.
2003-02-20

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