Tadayon; Pooya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tadayon; Pooya.The latest application filed is for "coreless electronic substrates having embedded inductors".

Company Profile

25.27.55

Tadayon; Pooya - Portland OR
Tadayon; Pooya - Hillsboro OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Coreless Electronic Substrates Having Embedded Inductors App 20220285079 - Pietambaram; Srinivas ; et al.	2022-09-08
Sloped metal features for cooling hotspots in stacked-die packages Grant 11,398,414 - Wan , et al. July 26, 2	2022-07-26
Slip-plane MEMs probe for high-density and fine pitch interconnects Grant 11,372,023 - Walczyk , et al. June 28, 2	2022-06-28
Chevron Interconnect For Very Fine Pitch Probing App 20220178966 - Tadayon; Pooya	2022-06-09
Method And Apparatus To Develop Lithographically Defined High Aspect Ratio Interconnects App 20220091511 - Tadayon; Pooya	2022-03-24
Chevron interconnect for very fine pitch probing Grant 11,268,983 - Tadayon March 8, 2	2022-03-08
Fine pitch probe card methods and systems Grant 11,262,384 - Tadayon , et al. March 1, 2	2022-03-01
High density and fine pitch interconnect structures in an electric test apparatus Grant 11,249,113 - Tadayon , et al. February 15, 2	2022-02-15
Thermal Spreading Management Of 3d Stacked Integrated Circuits App 20210398966 - Sankman; Robert L. ; et al.	2021-12-23
Method and apparatus to develop lithographically defined high aspect ratio interconnects Grant 11,204,555 - Tadayon December 21, 2	2021-12-21
Thermally Enhanced Silicon Back End Layers For Improved Thermal Performance App 20210391244 - JHA; Chandra Mohan ; et al.	2021-12-16
Low Force Liquid Metal Interconnect Solutions App 20210392774 - MEYYAPPAN; Karumbu ; et al.	2021-12-16
Hybrid Thermal Interface Material (tim) With Reduced 3d Thermal Resistance App 20210375716 - Tadayon; Pooya ; et al.	2021-12-02
Selective recess of interconnects for probing hybrid bond devices Grant 11,189,585 - Mueller , et al. November 30, 2	2021-11-30
Directly Impinging Pressure Modulated Spray Cooling And Methods Of Target Temperature Control App 20210351106 - SUBRAHMANYAM; Prabhakar ; et al.	2021-11-11
Vacuum Modulated Two Phase Cooling Loop Performance Enhancement App 20210348624 - DIGLIO; Paul ; et al.	2021-11-11
Vacuum Modulated Two Phase Cooling Loop Efficiency And Parallelism Enhancement App 20210351108 - Diglio; Paul ; et al.	2021-11-11
Multi-member Test Probe Structure App 20210302489 - Tadayon; Pooya ; et al.	2021-09-30
Thermal spreading management of 3D stacked integrated circuits Grant 11,127,727 - Sankman , et al. September 21, 2	2021-09-21
Slip-plane Mems Probe For High-density And Fine Pitch Interconnects App 20210239734 - Walczyk; Joe ; et al.	2021-08-05
Hyperchip App 20210225808 - BOHR; Mark T. ; et al.	2021-07-22
Multi-member test probe structure Grant 11,061,068 - Tadayon , et al. July 13, 2	2021-07-13
Selective Recess Of Interconnects For Probing Hybrid Bond Devices App 20210175192 - Mueller; Brennen K. ; et al.	2021-06-10
Hyperchip Grant 11,024,601 - Bohr , et al. June 1, 2	2021-06-01
Self Cooling Adaptive Flow Branching Heat Exchanger System For Cooling Of One Or More Semiconductor Chips App 20210120703 - SUBRAHMANYAM; Prabhakar ; et al.	2021-04-22
High Density And Fine Pitch Interconnect Structures In An Electric Test Apparatus App 20210088554 - Tadayon; Pooya ; et al.	2021-03-25
Slip-plane MEMS probe for high-density and fine pitch interconnects Grant 10,935,573 - Walczyk , et al. March 2, 2	2021-03-02
Double-sided Substrate With Cavities For Direct Die-to-die Interconnect App 20210035951 - TADAYON; Pooya	2021-02-04
Semiconductor Device Stack-up With Bulk Substrate Material To Mitigate Hot Spots App 20210028087 - KOTHARI; Shrenik ; et al.	2021-01-28
Deflected-pillar Composite Compliant Elongated Micro-structure Thermal Interface Materials App 20200411408 - Walczyk; Joe ; et al.	2020-12-31
High density and fine pitch interconnect structures in an electric test apparatus Grant 10,877,068 - Tadayon , et al. December 29, 2	2020-12-29
Interconnect structure with varying modulus of elasticity Grant 10,866,264 - Tadayon , et al. December 15, 2	2020-12-15
Thermal Spreading Management Of 3d Stacked Integrated Circuits App 20200388603 - Sankman; Robert L. ; et al.	2020-12-10
Liquid Cooling Through Conductive Interconnect App 20200328139 - CHIU; Chia-Pin ; et al.	2020-10-15
Converged test platforms and processes for class and system testing of integrated circuits Grant 10,677,845 - Detofsky , et al.	2020-06-09
Slip-plane Mems Probe For High-density And Fine Pitch Interconnects App 20200103440 - Walczyk; Joe ; et al.	2020-04-02
Sloped Metal Features For Cooling Hotspots In Stacked-die Packages App 20200098666 - WAN; ZHIMIN ; et al.	2020-03-26
Double-beam Test Probe App 20200096567 - Diglio; Paul J. ; et al.	2020-03-26
Ultra Low-cost, Low Leadtime, And High Density Space Transformer For Fine Pitch Applications App 20200072871 - Tadayon; Pooya ; et al.	2020-03-05
Hyperchip App 20200066679 - BOHR; Mark T. ; et al.	2020-02-27
High Density And Fine Pitch Interconnect Structures In An Electric Test Apparatus App 20200025801 - Tadayon; Pooya ; et al.	2020-01-23
Cooling Apparatuses For Microelectronic Assemblies App 20190385925 - Walczyk; Joe F. ; et al.	2019-12-19
High density and fine pitch interconnect structures in an electric test apparatus Grant 10,488,438 - Tadayon , et al. Nov	2019-11-26
Fine Pitch Probe Card Methods And Systems App 20190310287 - Tadayon; Pooya ; et al.	2019-10-10
Interconnect Structure With Varying Modulus Of Elasticity App 20190212363 - Tadayon; Pooya ; et al.	2019-07-11
High Density And Fine Pitch Interconnect Structures In An Electric Test Apparatus App 20190212366 - Tadayon; Pooya ; et al.	2019-07-11
Massively-parallel Micronozzle Array For Direct Write Electrodeposition Of High-density Microstructure Arrays App 20190203370 - Walczyk; Joe ; et al.	2019-07-04
Method And Apparatus To Develop Lithographically Defined High Aspect Ratio Interconnects App 20190204744 - Tadayon; Pooya	2019-07-04
Multi-member Test Probe Structure App 20190170810 - Tadayon; Pooya ; et al.	2019-06-06
Chevron Interconnect For Very Fine Pitch Probing App 20190004089 - Tadayon; Pooya	2019-01-03
Space transformation methods Grant 10,101,381 - Acar , et al. October 16, 2	2018-10-16
Converged Test Platforms And Processes For Class And System Testing Of Integrated Circuits App 20180252772 - Detofsky; Abram M. ; et al.	2018-09-06
Interconnects including liquid metal Grant 9,523,713 - Oh , et al. December 20, 2	2016-12-20
Increasing current carrying capability through direct liquid cooling of test contacts Grant 9,360,502 - Crippen , et al. June 7, 2	2016-06-07
Sort Probe Over Current Protection Mechanism App 20150077150 - Norris; Benjamin J. ; et al.	2015-03-19
Sort probe over current protection mechanism Grant 8,937,794 - Norris , et al. January 20, 2	2015-01-20
Interconnects Including Liquid Metal App 20140354318 - Oh; Youngseok ; et al.	2014-12-04
Metrology And Methods For Detection Of Liquid App 20140224990 - Stevenson; Kip P. ; et al.	2014-08-14
Increasing Current Carrying Capability Through Direct Liquid Cooling Of Test Contacts App 20140210499 - Crippen; Warren S. ; et al.	2014-07-31
Sort Probe Over Current Protection Mechanism App 20140092505 - Norris; Benjamin J. ; et al.	2014-04-03
Space Transformation Methods App 20140062522 - Acar; Erkan ; et al.	2014-03-06
Temporary package for at-speed functional test of semiconductor chip Grant 7,960,190 - Moret , et al. June 14, 2	2011-06-14
Temporary Package For At-speed Functional Test Of Semiconductor Chip App 20100151598 - Moret; Eric J. M. ; et al.	2010-06-17
Accurate alignment of semiconductor devices and sockets App 20080238460 - Kress; Lothar ; et al.	2008-10-02
Electrical energy-generating system and devices and methods related thereto Grant 7,411,337 - Tadayon , et al. August 12, 2	2008-08-12
Sort interface unit having probe capacitors App 20060038576 - Tadayon; Pooya	2006-02-23
Electrical energy-generating heat sink system and method of using same to recharge an energy storage device Grant 6,877,318 - Tadayon , et al. April 12, 2	2005-04-12
Electrical energy-generating heat sink system and method of using same to recharge an energy storage device App 20050029903 - Tadayon, Pooya ; et al.	2005-02-10
Chip package enabling increased input/output density Grant 6,627,978 - Dujari , et al. September 30, 2	2003-09-30
Electrical energy-generating heat sink system and method of using same to recharge an energy storage device Grant 6,574,963 - Tadayon , et al. June 10, 2	2003-06-10
Chip package enabling increased input/output density App 20030064584 - Dujari, Prateek ; et al.	2003-04-03

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