TADA; Shinji
Patent Applications and Registrations
Patent applications and USPTO patent grants for TADA; Shinji.The latest application filed is for "semiconductor device with a laser-connected terminal".
- TADA; Shinji - Matsumoto-city JP
- Tada; Shinji - Tokyo JP
- Tada; Shinji - Kawasaki JP
- Tada; Shinji - Hino JP
- TADA; Shinji - Hino-city JP
- TADA; Shinji - Kawasaki-shi JP
- Tada; Shinji - Nagoya JP
| Patent | Date |
|---|---|
| Semiconductor Device With A Laser-connected Terminal App 20210407955 - TADA; Shinji ; et al. | 2021-12-30 |
| Semiconductor device Grant 10,446,460 - Gohara , et al. Oc | 2019-10-15 |
| Semiconductor device and manufacturing method of semiconductor device Grant 10,157,877 - Kido , et al. Dec | 2018-12-18 |
| Semiconductor Device App 20180315676 - GOHARA; Hiromichi ; et al. | 2018-11-01 |
| Semiconductor device and method for manufacturing the semiconductor device Grant 9,786,587 - Nishizawa , et al. October 10, 2 | 2017-10-10 |
| Thermocompression bonding structure and thermocompression bonding method Grant 9,579,746 - Kinoshita , et al. February 28, 2 | 2017-02-28 |
| Semiconductor device Grant 9,504,154 - Tada , et al. November 22, 2 | 2016-11-22 |
| Semiconductor Device And Method For Manufacturing The Semiconductor Device App 20160322287 - NISHIZAWA; Tatsuo ; et al. | 2016-11-03 |
| Semiconductor device and method for manufacturing the semiconductor device Grant 9,406,603 - Nishizawa , et al. August 2, 2 | 2016-08-02 |
| Semiconductor Device And Manufacturing Method Of Semiconductor Device App 20160035690 - KIDO; Kazumasa ; et al. | 2016-02-04 |
| Semiconductor Device App 20140355219 - TADA; Shinji ; et al. | 2014-12-04 |
| Thermocompression Bonding Structure And Thermocompression Bonding Method App 20140301769 - KINOSHITA; Yoshito ; et al. | 2014-10-09 |
| Semiconductor Device And Method For Manufacturing The Semiconductor Device App 20140246783 - NISHIZAWA; Tatsuo ; et al. | 2014-09-04 |
| Manufacturing method of electric contact and manufacturing equipment of electric contact Grant 8,196,300 - Imamura , et al. June 12, 2 | 2012-06-12 |
| Manufacturing Method Of Electric Contact And Manufacturing Equipment Of Electric Contact App 20110099808 - Imamura; Seiji ; et al. | 2011-05-05 |
| Solder alloy Grant 6,365,097 - Yamashita , et al. April 2, 2 | 2002-04-02 |
| Solder alloys Grant 6,179,935 - Yamashita , et al. January 30, 2 | 2001-01-30 |
| Forming die and managing method thereof Grant 6,135,752 - Enomoto , et al. October 24, 2 | 2000-10-24 |
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