loadpatents
Patent applications and USPTO patent grants for TADA; Kazuhiro.The latest application filed is for "semiconductor device and manufacturing method therefor".
Patent | Date |
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Semiconductor Device And Manufacturing Method Therefor App 20220262761 - KITAGAWA; Tatsuya ;   et al. | 2022-08-18 |
Silicone rubber composite material and vibration isolating member Grant 11,279,828 - Tada , et al. March 22, 2 | 2022-03-22 |
Vibration-isolating Device App 20220009312 - HAYASHI; Kazuhiro ;   et al. | 2022-01-13 |
Refrigeration Cycle Device App 20210190389 - TADA; Kazuhiro ;   et al. | 2021-06-24 |
Image display device Grant 10,909,908 - Yamamoto , et al. February 2, 2 | 2021-02-02 |
Heat pump system Grant 10,889,163 - Tada January 12, 2 | 2021-01-12 |
Friction material composition, friction material, and friction member Grant 10,843,933 - Kamada , et al. November 24, 2 | 2020-11-24 |
Silicone Rubber Composite Material And Vibration Isolating Member App 20200354573 - TADA; Kazuhiro ;   et al. | 2020-11-12 |
Refrigerating cycle apparatus Grant 10,533,786 - Tada Ja | 2020-01-14 |
Friction Material Composition, Friction Material, And Friction Member App 20200002184 - Kamada; Shogo ;   et al. | 2020-01-02 |
Semiconductor device Grant 10,490,491 - Tada , et al. Nov | 2019-11-26 |
Refrigeration Cycle Apparatus App 20190316822 - TADA; Kazuhiro ;   et al. | 2019-10-17 |
Ejector Refrigeration Circuit App 20190128569 - TADA; Kazuhiro ;   et al. | 2019-05-02 |
Image Display Device App 20190103051 - YAMAMOTO; Masahiro ;   et al. | 2019-04-04 |
Heat Pump System App 20190030992 - TADA; Kazuhiro | 2019-01-31 |
Heat conductive insulating sheet, power module, and manufacturing method thereof Grant 10,177,068 - Mimura , et al. J | 2019-01-08 |
Semiconductor Device App 20180269140 - TADA; Kazuhiro ;   et al. | 2018-09-20 |
Refrigerating Cycle Apparatus App 20180156509 - TADA; Kazuhiro | 2018-06-07 |
Semiconductor device and method of manufacturing the same Grant 9,390,995 - Yamamoto , et al. July 12, 2 | 2016-07-12 |
Semiconductor device having a bulge portion and manufacturing method therefor Grant 9,320,173 - Yamamoto , et al. April 19, 2 | 2016-04-19 |
Power semiconductor module Grant 9,299,628 - Miki , et al. March 29, 2 | 2016-03-29 |
Heat Conductive Insulating Sheet, Power Module, And Manufacturing Method Thereof App 20160013116 - MIMURA; Kenji ;   et al. | 2016-01-14 |
Power semiconductor module Grant 9,129,885 - Nakayama , et al. September 8, 2 | 2015-09-08 |
Semiconductor Device And Manufacturing Method Therefor App 20150016064 - Yamamoto; Kei ;   et al. | 2015-01-15 |
Semiconductor Device And Method Of Manufacturing The Same App 20140367702 - Yamamoto; Kei ;   et al. | 2014-12-18 |
Electronic device casing with a water inhibitor Grant 8,894,242 - Tada , et al. November 25, 2 | 2014-11-25 |
Semiconductor device and method of manufacturing the same Grant 8,741,695 - Oka , et al. June 3, 2 | 2014-06-03 |
Power Semiconductor Module App 20140138707 - Miki; Takayoshi ;   et al. | 2014-05-22 |
Electronic apparatus Grant 8,654,544 - Suzuki , et al. February 18, 2 | 2014-02-18 |
Semiconductor Device And Method Of Manufacturing The Same App 20130181225 - OKA; Seiji ;   et al. | 2013-07-18 |
Electronic Equipment App 20130077215 - Tada; Kazuhiro ;   et al. | 2013-03-28 |
Power Semiconductor Module App 20120286292 - Nakayama; Yasushi ;   et al. | 2012-11-15 |
Electronic Device App 20120273244 - TAKITA; Hiroyuki ;   et al. | 2012-11-01 |
Electronic Apparatus App 20120275160 - Tada; Kazuhiro ;   et al. | 2012-11-01 |
Electronic Apparatus App 20120247992 - SUZUKI; Takashi ;   et al. | 2012-10-04 |
Electronic Apparatus And Flexible Substrate App 20120252535 - KAJIWARA; Yoshifumi ;   et al. | 2012-10-04 |
Heat conductive sheet and method for producing same, and powder module Grant 8,193,633 - Mimura , et al. June 5, 2 | 2012-06-05 |
Power Module And Method For Detecting Insulation Degradation Thereof App 20120039045 - Yin; Xiaohong ;   et al. | 2012-02-16 |
Heat Conductive Sheet And Power Module App 20100226095 - Mimura; Kenji ;   et al. | 2010-09-09 |
Semiconductor device and method for producing the same Grant 7,671,453 - Hayashi , et al. March 2, 2 | 2010-03-02 |
Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer Grant 7,151,311 - Nakajima , et al. December 19, 2 | 2006-12-19 |
Lighted switch device Grant 7,014,330 - Yokoyama , et al. March 21, 2 | 2006-03-21 |
Semiconductor device and method for producing the same App 20050067719 - Hayashi, Kenichi ;   et al. | 2005-03-31 |
Lighted switch device App 20040109304 - Yokoyama, Tatsuya ;   et al. | 2004-06-10 |
Mold resin-sealed power semiconductor device having insulating resin layer fixed on bottom surface of heat sink and metal layer on the resin layer App 20040089928 - Nakajima, Dai ;   et al. | 2004-05-13 |
Process for producing amines Grant 5,589,596 - Furutani , et al. December 31, 1 | 1996-12-31 |
Memory circuit having a plurality of cell arrays Grant 4,768,171 - Tada August 30, 1 | 1988-08-30 |
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