Tachikawa; Toru
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tachikawa; Toru.The latest application filed is for "plastic molded semiconductor package and method of manufacturing the same".
- Tachikawa; Toru - Hyogo JP
- Tachikawa; Toru - Itami JP
| Patent | Date |
|---|---|
| Plastic molded semiconductor package and method of manufacturing the same Grant 6,046,071 - Sawai , et al. April 4, 2 | 2000-04-04 |
| Plastic molded semiconductor package and method of manufacturing the same Grant 5,834,340 - Sawai , et al. November 10, 1 | 1998-11-10 |
| Plastic molded semiconductor package and method of manufacturing the same Grant 5,710,062 - Sawai , et al. January 20, 1 | 1998-01-20 |
| Plastic molded semiconductor package Grant 5,554,887 - Sawai , et al. September 10, 1 | 1996-09-10 |
| IC card having adhesion-preventing sheets Grant 5,327,010 - Uenaka , et al. July 5, 1 | 1994-07-05 |
| Semiconductor device having particular power distribution interconnection arrangement Grant 5,309,021 - Shimamoto , et al. May 3, 1 | 1994-05-03 |
| IC card Grant 5,299,940 - Uenaka , et al. April 5, 1 | 1994-04-05 |
| Battery terminal mounting means for a portable electrical device Grant 5,299,955 - Maeda , et al. April 5, 1 | 1994-04-05 |
| Semiconductor device card having a plurality of self-locking pawls Grant 5,278,445 - Uemura , et al. January 11, 1 | 1994-01-11 |
| Semiconductor device card and method of manufacturing the same Grant 5,173,841 - Uenaka , et al. December 22, 1 | 1992-12-22 |
| Modular semiconductor device Grant 5,025,307 - Ueda , et al. June 18, 1 | 1991-06-18 |
| Connecting electrode Grant 5,024,605 - Kasatani , et al. June 18, 1 | 1991-06-18 |
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