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Patent applications and USPTO patent grants for Tachibana; Ken.The latest application filed is for ""lead-free solder ball"".
Patent | Date |
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Solder alloy, solder ball, chip solder, solder paste, and solder joint Grant 10,773,345 - Tachibana , et al. Sept | 2020-09-15 |
Solder alloy, solder ball, and solder joint Grant 10,500,680 - Tachibana , et al. Dec | 2019-12-10 |
Lead-free solder, lead-free solder ball, solder joint using the lead-free solder and semiconductor circuit having the solder joint Grant 10,434,608 - Tachibana , et al. O | 2019-10-08 |
Lead-free solder alloy Grant 10,343,238 - Suzuki , et al. July 9, 2 | 2019-07-09 |
"Lead-Free Solder Ball" App 20190088611 - Yamanaka; Yoshie ;   et al. | 2019-03-21 |
Lead-Free Solder Alloy App 20190076966 - Ohnishi; Tsukasa ;   et al. | 2019-03-14 |
Solder Alloy, Solder Ball, Chip Solder, Solder Paste, and Solder Joint App 20190070696 - Tachibana; Ken ;   et al. | 2019-03-07 |
Solder Alloy, Solder Ball, And Solder Joint App 20180361519 - TACHIBANA; Ken ;   et al. | 2018-12-20 |
Lead-free solder alloy Grant 10,076,808 - Ohnishi , et al. September 18, 2 | 2018-09-18 |
Lead-free Solder Alloy App 20180001426 - SUZUKI; Masayuki ;   et al. | 2018-01-04 |
Lead-Free Solder Ball App 20180005970 - Yamanaka; Yoshie ;   et al. | 2018-01-04 |
Lead-free solder alloy and in-vehicle electronic circuit Grant 9,837,757 - Yoshikawa , et al. December 5, 2 | 2017-12-05 |
Lead-free solder ball Grant 9,780,055 - Yamanaka , et al. October 3, 2 | 2017-10-03 |
Solder Alloy, Solder Ball, Chip Solder, Solder Paste and Solder Joint App 20170216975 - TACHIBANA; Ken ;   et al. | 2017-08-03 |
Lead-free solder ball Grant 9,527,167 - Ohnishi , et al. December 27, 2 | 2016-12-27 |
Lead-Free Solder Ball App 20160339543 - Ohnishi; Tsukasa ;   et al. | 2016-11-24 |
Lead-Free Solder, Lead-Free Solder Ball, Solder Joint Using the Lead-Free Solder and Semiconductor Circuit Having the Solder Joint App 20160214212 - Tachibana; Ken ;   et al. | 2016-07-28 |
Soldering method using a low-temperature solder paste Grant 9,402,321 - Shimamura , et al. July 26, 2 | 2016-07-26 |
Lead-Free Solder Alloy App 20160074971 - Tachibana; Ken ;   et al. | 2016-03-17 |
Lead-free Solder Alloy And In-vehicle Electronic Circuit App 20160056570 - YOSHIKAWA; Shunsaku ;   et al. | 2016-02-25 |
Lead-free Solder Alloy App 20150328722 - SUZUKI; Masayuki ;   et al. | 2015-11-19 |
Soldering Method Using A Low-temperature Solder Paste App 20150282332 - Shimamura; Masato ;   et al. | 2015-10-01 |
Lead-Free Solder Ball App 20150221606 - Yamanaka; Yoshie ;   et al. | 2015-08-06 |
Lead-Free Solder Alloy App 20150037087 - Tachibana; Ken ;   et al. | 2015-02-05 |
Lead-Free Solder Alloy App 20150037088 - Ohnishi; Tsukasa ;   et al. | 2015-02-05 |
Lead-Free Solder Ball App 20140061287 - Ohnishi; Tsukasa ;   et al. | 2014-03-06 |
Control apparatus of internal combustion engine Grant 7,210,452 - Nakashima , et al. May 1, 2 | 2007-05-01 |
Control apparatus of internal combustion engine App 20070017482 - Nakashima; Shogo ;   et al. | 2007-01-25 |
Apparatus for rewriting a memory in a vehicle mounted ECU through communications Grant 6,957,136 - Tachibana , et al. October 18, 2 | 2005-10-18 |
Start control apparatus of internal combustion engine Grant 6,945,208 - Yonezawa , et al. September 20, 2 | 2005-09-20 |
Start control apparatus of internal combustion engine App 20040194749 - Yonezawa, Shiro ;   et al. | 2004-10-07 |
Apparatus for rewriting a memory in a vehicle mounted ECU through communications App 20040002793 - Tachibana, Ken ;   et al. | 2004-01-01 |
Fuel injection control system for internal combustion engine of cylinder injection type Grant 6,112,716 - Tachibana September 5, 2 | 2000-09-05 |
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