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name:-0.065625905990601
name:-0.017125844955444
name:-0.0087699890136719
Tachibana; Ken Patent Filings

Tachibana; Ken

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tachibana; Ken.The latest application filed is for ""lead-free solder ball"".

Company Profile
7.15.22
  • Tachibana; Ken - Chiba JP
  • Tachibana; Ken - Tokyo JP
  • Tachibana; Ken - Chiba-ken JP
  • Tachibana; Ken - Hyogo JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Solder alloy, solder ball, chip solder, solder paste, and solder joint
Grant 10,773,345 - Tachibana , et al. Sept
2020-09-15
Solder alloy, solder ball, and solder joint
Grant 10,500,680 - Tachibana , et al. Dec
2019-12-10
Lead-free solder, lead-free solder ball, solder joint using the lead-free solder and semiconductor circuit having the solder joint
Grant 10,434,608 - Tachibana , et al. O
2019-10-08
Lead-free solder alloy
Grant 10,343,238 - Suzuki , et al. July 9, 2
2019-07-09
"Lead-Free Solder Ball"
App 20190088611 - Yamanaka; Yoshie ;   et al.
2019-03-21
Lead-Free Solder Alloy
App 20190076966 - Ohnishi; Tsukasa ;   et al.
2019-03-14
Solder Alloy, Solder Ball, Chip Solder, Solder Paste, and Solder Joint
App 20190070696 - Tachibana; Ken ;   et al.
2019-03-07
Solder Alloy, Solder Ball, And Solder Joint
App 20180361519 - TACHIBANA; Ken ;   et al.
2018-12-20
Lead-free solder alloy
Grant 10,076,808 - Ohnishi , et al. September 18, 2
2018-09-18
Lead-free Solder Alloy
App 20180001426 - SUZUKI; Masayuki ;   et al.
2018-01-04
Lead-Free Solder Ball
App 20180005970 - Yamanaka; Yoshie ;   et al.
2018-01-04
Lead-free solder alloy and in-vehicle electronic circuit
Grant 9,837,757 - Yoshikawa , et al. December 5, 2
2017-12-05
Lead-free solder ball
Grant 9,780,055 - Yamanaka , et al. October 3, 2
2017-10-03
Solder Alloy, Solder Ball, Chip Solder, Solder Paste and Solder Joint
App 20170216975 - TACHIBANA; Ken ;   et al.
2017-08-03
Lead-free solder ball
Grant 9,527,167 - Ohnishi , et al. December 27, 2
2016-12-27
Lead-Free Solder Ball
App 20160339543 - Ohnishi; Tsukasa ;   et al.
2016-11-24
Lead-Free Solder, Lead-Free Solder Ball, Solder Joint Using the Lead-Free Solder and Semiconductor Circuit Having the Solder Joint
App 20160214212 - Tachibana; Ken ;   et al.
2016-07-28
Soldering method using a low-temperature solder paste
Grant 9,402,321 - Shimamura , et al. July 26, 2
2016-07-26
Lead-Free Solder Alloy
App 20160074971 - Tachibana; Ken ;   et al.
2016-03-17
Lead-free Solder Alloy And In-vehicle Electronic Circuit
App 20160056570 - YOSHIKAWA; Shunsaku ;   et al.
2016-02-25
Lead-free Solder Alloy
App 20150328722 - SUZUKI; Masayuki ;   et al.
2015-11-19
Soldering Method Using A Low-temperature Solder Paste
App 20150282332 - Shimamura; Masato ;   et al.
2015-10-01
Lead-Free Solder Ball
App 20150221606 - Yamanaka; Yoshie ;   et al.
2015-08-06
Lead-Free Solder Alloy
App 20150037087 - Tachibana; Ken ;   et al.
2015-02-05
Lead-Free Solder Alloy
App 20150037088 - Ohnishi; Tsukasa ;   et al.
2015-02-05
Lead-Free Solder Ball
App 20140061287 - Ohnishi; Tsukasa ;   et al.
2014-03-06
Control apparatus of internal combustion engine
Grant 7,210,452 - Nakashima , et al. May 1, 2
2007-05-01
Control apparatus of internal combustion engine
App 20070017482 - Nakashima; Shogo ;   et al.
2007-01-25
Apparatus for rewriting a memory in a vehicle mounted ECU through communications
Grant 6,957,136 - Tachibana , et al. October 18, 2
2005-10-18
Start control apparatus of internal combustion engine
Grant 6,945,208 - Yonezawa , et al. September 20, 2
2005-09-20
Start control apparatus of internal combustion engine
App 20040194749 - Yonezawa, Shiro ;   et al.
2004-10-07
Apparatus for rewriting a memory in a vehicle mounted ECU through communications
App 20040002793 - Tachibana, Ken ;   et al.
2004-01-01
Fuel injection control system for internal combustion engine of cylinder injection type
Grant 6,112,716 - Tachibana September 5, 2
2000-09-05

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