Tabuchi; Tomotaka
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tabuchi; Tomotaka.The latest application filed is for "wafer processing method".
- Tabuchi; Tomotaka - Tokyo JP
| Patent | Date |
|---|---|
| Wafer processing method Grant 11,056,346 - Sandoh , et al. July 6, 2 | 2021-07-06 |
| Wafer Processing Method App 20210057225 - SANDOH; Hideyuki ; et al. | 2021-02-25 |
| Grinding Apparatus And Use Method Of Grinding Apparatus App 20200391337 - TABUCHI; Tomotaka ; et al. | 2020-12-17 |
| Wafer processing method for reforming protective film Grant 10,692,721 - Tabuchi , et al. | 2020-06-23 |
| Device chip manufacturing method Grant 10,468,303 - Tabuchi No | 2019-11-05 |
| Wafer dividing method Grant 10,354,919 - Tabuchi , et al. July 16, 2 | 2019-07-16 |
| Workpiece Processing Method App 20180330957 - Wei; Frank ; et al. | 2018-11-15 |
| Processing method for workpiece Grant 10,115,636 - Nishida , et al. October 30, 2 | 2018-10-30 |
| Device Chip Manufacturing Method App 20180308755 - Tabuchi; Tomotaka | 2018-10-25 |
| Wafer Processing Method App 20180166282 - Tabuchi; Tomotaka ; et al. | 2018-06-14 |
| Wafer Dividing Method App 20170140989 - Tabuchi; Tomotaka ; et al. | 2017-05-18 |
| Wafer processing method Grant 9,330,976 - Yakoo , et al. May 3, 2 | 2016-05-03 |
| Processing Method For Workpiece App 20160042962 - Nishida; Yoshiteru ; et al. | 2016-02-11 |
| Wafer Processing Method App 20160042996 - Yakoo; Susumu ; et al. | 2016-02-11 |
| Resin powder wafer processing utilizing a frame with a plurality of partitions Grant 9,123,797 - Sekiya , et al. September 1, 2 | 2015-09-01 |
| Wafer processing utilizing a frame with a plurality of partitions Grant 9,112,019 - Sekiya , et al. August 18, 2 | 2015-08-18 |
| Wafer Processing Method App 20150147870 - Sekiya; Kazuma ; et al. | 2015-05-28 |
| Wafer Processing Method App 20150140784 - Sekiya; Kazuma ; et al. | 2015-05-21 |
| Production method for semiconductor chip Grant 6,852,608 - Kitamura , et al. February 8, 2 | 2005-02-08 |
| Production method for semiconductor chip App 20040048419 - Kitamura, Masahiko ; et al. | 2004-03-11 |
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