loadpatents
name:-0.012667179107666
name:-0.0068840980529785
name:-0.0046370029449463
Tabuchi; Akira Patent Filings

Tabuchi; Akira

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tabuchi; Akira.The latest application filed is for "gel composition and production method therefor".

Company Profile
4.6.8
  • Tabuchi; Akira - Osaka JP
  • Tabuchi; Akira - Tokushima JP
  • Tabuchi, Akira - Tokushima-shi JP
  • Tabuchi; Akira - Naruto JP
  • Tabuchi; Akira - Kawasaki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Gel Composition And Production Method Therefor
App 20210230378 - Tabuchi; Akira ;   et al.
2021-07-29
Gel composition and production method therefor
Grant 11,021,578 - Tabuchi , et al. June 1, 2
2021-06-01
Gel composition, sheet, and production method therefor
Grant 10,702,455 - Tabuchi , et al.
2020-07-07
Gel Composition And Production Method Therefor
App 20190338081 - Tabuchi; Akira ;   et al.
2019-11-07
Gel Composition, Sheet, And Production Method Therefor
App 20190183746 - Tabuchi; Akira ;   et al.
2019-06-20
Pesticidal resin compositions and pesticidal products formed from the same
Grant 7,368,123 - Tabuchi , et al. May 6, 2
2008-05-06
Resin composition for reflecting plates
App 20070066736 - Tsutsumi; Hideyuki ;   et al.
2007-03-22
Dielectric resin foam and lens for radio waves using the same
Grant 7,179,844 - Aki , et al. February 20, 2
2007-02-20
Resin composition for reflecting plate
App 20050131121 - Tsutsumi, Hideyuki ;   et al.
2005-06-16
Dielectric resin foam and lens antenna comprising the same
App 20040029985 - Aki, Minoru ;   et al.
2004-02-12
Connector
App 20020182935 - Monde, Hiroyuki ;   et al.
2002-12-05
Air conditioner outlet vent device
App 20020031999 - Baba, Hideki ;   et al.
2002-03-14
Molded articles for holding wafers
Grant 5,240,753 - Tabuchi , et al. August 31, 1
1993-08-31
Method of selectively depositing tungsten upon a semiconductor substrate
Grant 4,804,560 - Shioya , et al. February 14, 1
1989-02-14

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