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Patent applications and USPTO patent grants for T'NG; CHEE-PIN.The latest application filed is for "image module package having glass filter secured by transparent adhesive".
Patent | Date |
---|---|
Image Module Package Having Glass Filter Secured By Transparent Adhesive App 20210143139 - T'NG; CHEE-PIN ;   et al. | 2021-05-13 |
Image module package having flat glass filter flush with transparent layer Grant 10,937,773 - T'ng , et al. March 2, 2 | 2021-03-02 |
Image Module Package App 20190139951 - T'NG; CHEE-PIN ;   et al. | 2019-05-09 |
Image module package with transparent sub-assembly Grant 10,211,191 - T'ng , et al. Feb | 2019-02-19 |
Apparatus and sensor chip component attaching method Grant 10,026,765 - T'Ng , et al. July 17, 2 | 2018-07-17 |
Apparatus And Sensor Chip Component Attaching Method App 20170133422 - T'NG; Chee Pin ;   et al. | 2017-05-11 |
Image Module Package And Manufacturing Method Thereof App 20160041029 - T'NG; Chee-Pin ;   et al. | 2016-02-11 |
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