Syu; Shih-Yi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Syu; Shih-Yi.The latest application filed is for "thermal dissipation through seal rings in 3dic structure".

Company Profile

4.11.11

Syu; Shih-Yi - Daxi Township TW
Syu; Shih-Yi - Hsin-Chu TW
Syu; Shih-Yi - Taoyuan TW
Syu; Shih-Yi - Taoyuan City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Thermal dissipation through seal rings in 3DIC structure Grant 11,037,854 - Lin , et al. June 15, 2	2021-06-15
Thermal Dissipation Through Seal Rings in 3DIC Structure App 20200152543 - Lin; Jing-Cheng ; et al.	2020-05-14
Thermal dissipation through seal rings in 3DIC structure Grant 10,535,580 - Lin , et al. Ja	2020-01-14
Fan-out package structure having stacked carrier substrates and method for forming the same Grant 10,515,887 - Syu , et al. Dec	2019-12-24
Thermal Dissipation Through Seal Rings in 3DIC Structure App 20190267305 - Lin; Jing-Cheng ; et al.	2019-08-29
Thermal dissipation through seal rings in 3DIC structure Grant 10,290,559 - Lin , et al.	2019-05-14
Semiconductor device and wafer level package including such semiconductor device Grant 10,224,287 - Syu , et al.	2019-03-05
Fan-out Package Structure Having Stacked Carrier Substrates And Method For Forming The Same App 20180082936 - SYU; Shih-Yi ; et al.	2018-03-22
Semiconductor Device And Wafer Level Package Including Such Semiconductor Device App 20170271265 - Syu; Shih-Yi ; et al.	2017-09-21
Semiconductor device and wafer level package including such semiconductor device Grant 9,704,808 - Syu , et al. July 11, 2	2017-07-11
Thermal Dissipation Through Seal Rings in 3DIC Structure App 20170053849 - Lin; Jing-Cheng ; et al.	2017-02-23
Thermal dissipation through seal rings in 3DIC structure Grant 9,490,190 - Lin , et al. November 8, 2	2016-11-08
Semiconductor Device And Wafer Level Package Including Such Semiconductor Device App 20160276277 - Syu; Shih-Yi ; et al.	2016-09-22
Structures and formation methods of packages with heat sinks Grant 8,816,495 - Wang , et al. August 26, 2	2014-08-26
Thermal Dissipation Through Seal Rings in 3DIC Structure App 20140084476 - Lin; Jing-Cheng ; et al.	2014-03-27
Methods for de-bonding carriers Grant 8,629,043 - Wang , et al. January 14, 2	2014-01-14
Structures and Formation Methods of Packages with Heat Sinks App 20130217188 - Wang; Chung Yu ; et al.	2013-08-22
Methods for De-Bonding Carriers App 20130122689 - Wang; Chung Yu ; et al.	2013-05-16

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.