Syoujiguchi; Takashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Syoujiguchi; Takashi.The latest application filed is for "metal foil provided with filler-containing resin layer and method for manufacturing metal foil provided with filler-containing resin layer".

Company Profile

0.5.5

Syoujiguchi; Takashi - Saitama JP
Syoujiguchi; Takashi - Ageo JP
Syoujiguchi, Takashi - Ageo-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Metal foil provided with filler-containing resin layer and method for manufacturing metal foil provided with filler-containing resin layer Grant 9,396,834 - Syoujiguchi July 19, 2	2016-07-19
Metal Foil Provided With Filler-containing Resin Layer And Method For Manufacturing Metal Foil Provided With Filler-containing Resin Layer App 20130177739 - Syoujiguchi; Takashi	2013-07-11
Double-sided copper-clad laminate for forming capacitor layer and method for manufacture thereof, and printed wiring board obtained using the double-sided copper-clad laminate for forming capacitor layer Grant 6,986,937 - Yamazaki , et al. January 17, 2	2006-01-17
Roll of laminate for capacitor layer for withstand voltage inspection and method of withstand voltage measurement using this roll of laminate for capacitor layer for withstand voltage inspection Grant 6,903,916 - Yamazaki , et al. June 7, 2	2005-06-07
Double-sided copper-clad laminate for forming capacitor layer and method for manufacture thereof, and printed wiring board obtained using the double-sided copper-clad laminate for forming capacitor layer App 20040161593 - Yamazaki, Kazuhiro ; et al.	2004-08-19
Roll Of Laminate For Capacitor Layer For Withstand Voltage Inspection And Method Of Withstand Voltage Measurement Using This Roll Of Laminate For Capacitor Layer For Withstand Voltage Inspection App 20040120098 - Yamazaki, Kazuhiro ; et al.	2004-06-24
Cooper clad laminate with cooper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with cooper-plated circuit layer Grant 6,652,993 - Yamamoto , et al. November 25, 2	2003-11-25
Copper clad laminate with copper-plated circuit layer, and method for manufacturing printed wiring board using the copper clad laminate with copper-plated circuit layer App 20020182434 - Yamamoto, Takuya ; et al.	2002-12-05

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