Sye; Chiping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sye; Chiping.The latest application filed is for "mailing machine transport system with integral scale for weighing mail pieces".

Company Profile

0.4.6

Sye; Chiping - Stamford CT US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Adjustable media width sensor for a mailing machine Grant 8,397,399 - Sye , et al. March 19, 2	2013-03-19
Mailing machine transport system with integral scale for weighing mail pieces where the contact force on the take away rollers is reduced to eliminate oscillations of the weighing platform Grant 8,148,650 - Sye April 3, 2	2012-04-03
Mailing Machine Transport System With Integral Scale For Weighing Mail Pieces App 20110147095 - Sye; Chiping	2011-06-23
Adjustable Media Width Sensor for a Mailing Machine App 20110079447 - Sye; Chiping ; et al.	2011-04-07
Method and device for aligning sheets in a transport module App 20070132179 - Fairweather; James A. ; et al.	2007-06-14
Moistening device for sealing envelope flaps App 20070079938 - Paradis; Jason P. ; et al.	2007-04-12
Jam release mechanism for a mailing machine App 20060220294 - Sye; Chiping	2006-10-05
Gear train mating interface for separable mailing machine modules Grant 6,810,760 - Sye , et al. November 2, 2	2004-11-02
Gear train mating interface for separable mailing machine modules App 20040055406 - Sye, Chiping ; et al.	2004-03-25

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