Patent | Date |
---|
Method for modifying substrates based on crystal lattice dislocation density Grant 11,309,191 - Beyer , et al. April 19, 2 | 2022-04-19 |
Combined laser treatment of a solid body to be split Grant 11,130,200 - Rieske , et al. September 28, 2 | 2021-09-28 |
Method for splitting semiconductor wafers Grant 11,081,393 - Beyer , et al. August 3, 2 | 2021-08-03 |
Method for Thinning Solid-Body Layers Provided with Components App 20210225709 - Rieske; Ralf ;   et al. | 2021-07-22 |
Method and device for producing planar modifications in solid bodies Grant 11,059,202 - Rieske , et al. July 13, 2 | 2021-07-13 |
Method for Reducing the Thickness of Solid-State Layers Provided with Components App 20210197314 - Swoboda; Marko ;   et al. | 2021-07-01 |
Method for Splitting Semiconductor Wafers App 20210175123 - Beyer; Christian ;   et al. | 2021-06-10 |
Method for forming a crack in the edge region of a donor substrate, using an inclined laser beam Grant 10,994,442 - Swoboda , et al. May 4, 2 | 2021-05-04 |
Method for thinning solid body layers provided with components Grant 10,978,311 - Drescher , et al. April 13, 2 | 2021-04-13 |
Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor Devices App 20210053148 - Rieske; Ralf ;   et al. | 2021-02-25 |
Method for Producing Short Subcritical Cracks in Solid Bodies App 20200398381 - Richter; Jan ;   et al. | 2020-12-24 |
Method for Producing Wafers with Modification Lines of Defined Orientation App 20200388538 - Swoboda; Marko ;   et al. | 2020-12-10 |
Polymer hybrid material for use in a splitting method Grant 10,858,495 - Beyer , et al. December 8, 2 | 2020-12-08 |
Method And Apparatus For Producing At Least One Modification In A Solid Body App 20200343147 - RIESKE; Ralf ;   et al. | 2020-10-29 |
Production Facility for Separating Wafers from Donor Substrates App 20200254650 - Kind Code | 2020-08-13 |
Device and Method for Applying Pressure to Stress-Producing Layers for Improved Guidance of a Separation Crack App 20200215648 - Swoboda; Marko ;   et al. | 2020-07-09 |
Method for guiding a crack in the peripheral region of a donor substrate Grant 10,676,386 - Swoboda , et al. | 2020-06-09 |
Method for Thinning Solid Body Layers Provided with Components App 20200066542 - Drescher; Wolfram ;   et al. | 2020-02-27 |
Method for Modifying Substrates Based on Crystal Lattice Dislocation Density App 20200051831 - Beyer; Christian ;   et al. | 2020-02-13 |
Method And Device For Producing Planar Modifications In Solid Bodies App 20190366586 - Rieske; Ralf ;   et al. | 2019-12-05 |
Method for Separating Solid Body Layers from Composite Structures Made of SiC and a Metallic Coating or Electrical Components App 20190337100 - Richter; Jan ;   et al. | 2019-11-07 |
Laser Conditioning of Solid Bodies Using Prior Knowledge from Previous Machining Steps App 20190302725 - Swoboda; Marko ;   et al. | 2019-10-03 |
Method For Guiding A Crack In The Peripheral Region Of A Donor Substrate App 20190218131 - Swoboda; Marko ;   et al. | 2019-07-18 |
Method for guiding a crack in the peripheral region of a donor substrate Grant 10,280,107 - Swoboda , et al. | 2019-05-07 |
Combined Laser Treatment Of A Solid Body To Be Split App 20190099838 - Rieske; Ralf ;   et al. | 2019-04-04 |
Polymer Hybrid Material For Use In A Splitting Method App 20190071552 - BEYER; Christian ;   et al. | 2019-03-07 |
Method For Forming A Crack In The Edge Region Of A Donor Substrate, Using An Inclined Laser Beam App 20180370073 - Swoboda; Marko ;   et al. | 2018-12-27 |
Method For Guiding A Crack In The Peripheral Region Of A Donor Substrate App 20180185957 - Swoboda; Marko ;   et al. | 2018-07-05 |
Apparatus And Method For Continuous Treatment Of A Solid Body By Means Of Laser Beam App 20180154572 - Richter; Jan ;   et al. | 2018-06-07 |