loadpatents
name:-0.013234853744507
name:-0.0095391273498535
name:-0.00034403800964355
Swinnen; Bart Patent Filings

Swinnen; Bart

Patent Applications and Registrations

Patent applications and USPTO patent grants for Swinnen; Bart.The latest application filed is for "semiconductor device having through-substrate vias".

Company Profile
0.10.10
  • Swinnen; Bart - Holsbeek BE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for producing contact areas on a semiconductor substrate
Grant 10,332,850 - Beyne , et al.
2019-06-25
Semiconductor device having through-substrate vias
Grant 9,646,930 - Tezcan , et al. May 9, 2
2017-05-09
Semiconductor Device Having Through-substrate Vias
App 20150035168 - Tezcan; Deniz Sabuncuoglu ;   et al.
2015-02-05
Method for Producing Contact Areas on a Semiconductor Substrate
App 20140374919 - Beyne; Eric ;   et al.
2014-12-25
Method for fabricating through substrate vias
Grant 8,809,188 - Tezcan , et al. August 19, 2
2014-08-19
IC interconnect
Grant 8,076,768 - Kaskoun , et al. December 13, 2
2011-12-13
Method of fabricating via first plus via last IC interconnect
Grant 7,985,620 - Kaskoun , et al. July 26, 2
2011-07-26
Via first plus via last technique for IC interconnects
Grant 7,939,926 - Kaskoun , et al. May 10, 2
2011-05-10
Method For Fabricating Through Substrate Vias
App 20110089572 - Tezcan; Deniz Sabuncuoglu ;   et al.
2011-04-21
IC Interconnect
App 20110042829 - Kaskoun; Kenneth ;   et al.
2011-02-24
Method For Producing Electrical Interconnects And Devices Made Thereof
App 20100264538 - Swinnen; Bart ;   et al.
2010-10-21
Via First Plus Via Last Technique for IC Interconnect
App 20100261310 - Kaskoun; Kenneth ;   et al.
2010-10-14
Method for bonding a die or substrate to a carrier
Grant 7,795,113 - Swinnen , et al. September 14, 2
2010-09-14
Via First Plus Via Last Technique for IC Interconnects
App 20100148371 - Kaskoun; Kenneth ;   et al.
2010-06-17
Method for chip singulation
Grant 7,566,634 - Beyne , et al. July 28, 2
2009-07-28
Method For Bonding A Die Or Substrate To A Carrier
App 20080166525 - Swinnen; Bart ;   et al.
2008-07-10
Alignment Strategy Optimization Method
App 20060103822 - Werkman; Roy ;   et al.
2006-05-18
Alignment strategy optimization method
Grant 7,042,552 - Werkman , et al. May 9, 2
2006-05-09
Method for chip singulation
App 20060068567 - Beyne; Eric ;   et al.
2006-03-30

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