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Patent applications and USPTO patent grants for Swendrowski; Steven.The latest application filed is for "manipulation and handling of integrated circuit dice".
Patent | Date |
---|---|
Manipulation and handling of integrated circuit dice Grant 4,915,565 - Bond , et al. April 10, 1 | 1990-04-10 |
Chip selection in automatic assembly of integrated circuit Grant 4,759,675 - Bond , et al. July 26, 1 | 1988-07-26 |
Integrated-circuit leadframe adapted for a simultaneous bonding operation Grant 4,722,060 - Quinn , et al. January 26, 1 | 1988-01-26 |
Manipulation and handling of integrated circuit dice Grant 4,626,167 - Bond , et al. December 2, 1 | 1986-12-02 |
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