Swee Seng; Eric Tan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Swee Seng; Eric Tan.The latest application filed is for "reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components".
- Swee Seng; Eric Tan - Singapore SG
- Swee Seng, Eric Tan - Republic of Singapore SG
| Patent | Date |
|---|---|
| Reduced Footprint Packaged Microelectronic Components And Methods For Manufacturing Such Microelectronic Components App 20080067634 - Swee Seng; Eric Tan | 2008-03-20 |
| Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads App 20060202319 - Swee Seng; Eric Tan | 2006-09-14 |
| Assemblies including stacked semiconductor dice having centrally located, wire bonded bond pads App 20060022323 - Swee Seng; Eric Tan | 2006-02-02 |
| Packaged microelectronic component assemblies App 20040100772 - Chye, Lim Thiam ; et al. | 2004-05-27 |
| Packaged Microelectronic Devices And Methods Of Forming Same App 20030042581 - Fee, Setho Sing ; et al. | 2003-03-06 |
| Ball grid array interposer, packages and methods App 20020142513 - Fee, Setho Sing ; et al. | 2002-10-03 |
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