| Patent | Date |
|---|
Collector tailored structures for integration of binary junction transistors
Grant 7,462,546 - Chuang , et al. December 9, 2 | 2008-12-09 |
Collector tailored structures for integration of binary junction transistors
App 20070249135 - Chuang; Ming-Yeh ; et al. | 2007-10-25 |
Method and system for packaging ball grid arrays
Grant 7,135,397 - Howard , et al. November 14, 2 | 2006-11-14 |
Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement
App 20060226521 - Coyle; Anthony L. ; et al. | 2006-10-12 |
Method of forming integrated circuit contacts
Grant 7,087,479 - Swanson , et al. August 8, 2 | 2006-08-08 |
Semiconductor package having integrated metal parts for thermal enhancement
Grant 7,084,494 - Coyle , et al. August 1, 2 | 2006-08-01 |
Carbide emitter mask etch stop
Grant 7,034,379 - Swanson , et al. April 25, 2 | 2006-04-25 |
Semiconductor package having integrated metal parts for thermal enhancement
App 20050280124 - Coyle, Anthony L. ; et al. | 2005-12-22 |
Implant-controlled-channel vertical JFET
App 20050247955 - Howard, Gregory E. ; et al. | 2005-11-10 |
Multi-chip flip package with substrate for inter-die coupling
App 20050230842 - Swanson, Leland S. ; et al. | 2005-10-20 |
Double diffused vertical JFET
App 20050194621 - Howard, Gregory E. ; et al. | 2005-09-08 |
Wafer-level assembly method for chip-size devices having flipped chips
App 20050151268 - Boyd, William D. ; et al. | 2005-07-14 |
Scribe street width reduction by deep trench and shallow saw cut
App 20050140030 - Howard, Gregory E. ; et al. | 2005-06-30 |
Implant-controlled-channel vertical JFET
Grant 6,909,125 - Howard , et al. June 21, 2 | 2005-06-21 |
Scribe street width reduction by deep trench and shallow saw cut
Grant 6,890,836 - Howard , et al. May 10, 2 | 2005-05-10 |
Method and system for packaging ball grid arrays
App 20050064694 - Howard, Greg E. ; et al. | 2005-03-24 |
Method of forming integrated circuit contacts
App 20050064692 - Swanson, Leland S. ; et al. | 2005-03-24 |
Method and system for stud bumping
App 20050051600 - Howard, Greg E. ; et al. | 2005-03-10 |
Double diffused vertical JFET
Grant 6,861,678 - Howard , et al. March 1, 2 | 2005-03-01 |
Semiconductor circuit with mechanically attached lid
Grant 6,847,106 - Howard , et al. January 25, 2 | 2005-01-25 |
Double Diffused Vertical Jfet
App 20050012111 - Howard, Gregory E. ; et al. | 2005-01-20 |
Implant-controlled-channel vertical JFET
App 20050006663 - Howard, Gregory E. ; et al. | 2005-01-13 |
Method of forming integrated circuit contacts
Grant 6,833,300 - Swanson , et al. December 21, 2 | 2004-12-21 |
Using solder balls of multiple sizes to couple one or more semiconductor structures to an electrical device
App 20040245624 - Swanson, Leland S. ; et al. | 2004-12-09 |
Scribe street width reduction by deep trench and shallow saw cut
App 20040235272 - Howard, Gregory E. ; et al. | 2004-11-25 |
Scribe street width reduction by deep trench and shallow saw cut
App 20040232524 - Howard, Gregory E. ; et al. | 2004-11-25 |
Semiconductor device protective overcoat with enhanced adhesion to polymeric materials and method of fabrication
Grant 6,787,397 - Swanson , et al. September 7, 2 | 2004-09-07 |
Selective deposition of emissive layer in electroluminescent displays
Grant 6,780,662 - Swanson August 24, 2 | 2004-08-24 |
Laser alignment structure for integrated circuits
App 20040145066 - Swanson, Leland S. ; et al. | 2004-07-29 |
Method of forming integrated circuit contacts
App 20040147110 - Swanson, Leland S. ; et al. | 2004-07-29 |
Selective deposition of emissive layer in electroluminescent displays
App 20040086630 - Swanson, Leland S. | 2004-05-06 |
Selective deposition of emissive layer in electroluminescent displays
App 20040086629 - Swanson, Leland S. | 2004-05-06 |
Selective deposition of emissive layer in electroluminescent displays
App 20040086628 - Swanson, Leland S. | 2004-05-06 |
Carbide emitter mask etch stop
App 20040046233 - Swanson, Leland S. ; et al. | 2004-03-11 |
Carbide emitter mask etch stop
Grant 6,656,811 - Swanson , et al. December 2, 2 | 2003-12-02 |
Semiconductor device protective overcoat with enhanced adhesion to polymeric materials and method of fabrication
App 20030205812 - Swanson, Leland S. ; et al. | 2003-11-06 |
Selective deposition of emissive layer in electroluminescent displays
App 20030129299 - Swanson, Leland S. | 2003-07-10 |
Carbide emitter mask etch stop
App 20030119249 - Swanson, Leland S. ; et al. | 2003-06-26 |
Silicon carbide as a stop layer in chemical mechanical polishing for isolation dielectric
Grant 6,555,476 - Olsen , et al. April 29, 2 | 2003-04-29 |
Blocking of boron diffusion through the emitter-emitter poly interface in PNP HBTs through use of a SiC layer at the top of the emitter epi layer
Grant 6,552,375 - Swanson , et al. April 22, 2 | 2003-04-22 |
Selective deposition of emissive layer in electroluminescent displays
Grant 6,537,607 - Swanson March 25, 2 | 2003-03-25 |
Integrated circuit interconnect and method
Grant 6,528,426 - Olsen , et al. March 4, 2 | 2003-03-04 |
Integrated circuit isolation of functionally distinct RF circuits
Grant 6,503,838 - Swanson January 7, 2 | 2003-01-07 |
Air bridge/dielectric fill inductors
Grant 6,455,393 - Swanson September 24, 2 | 2002-09-24 |
Blocking of boron diffusion through the emitter-emitter poly interface in PNP HBTs through use of a SiC layer at the top of the emitter EPI layer
App 20020094658 - Swanson, Leland S. ; et al. | 2002-07-18 |
Variable porosity porous silicon isolation
Grant 6,376,859 - Swanson , et al. April 23, 2 | 2002-04-23 |
Annealed porous silicon with epitaxial layer for SOI
Grant 6,376,285 - Joyner , et al. April 23, 2 | 2002-04-23 |
Blocking of boron diffusion through the emitter-emitter poly interface in PNP HBTs through use of a SiC layer at the top of the emitter epi layer
Grant 6,362,065 - Swanson , et al. March 26, 2 | 2002-03-26 |
Semiconductor device protective overcoat with enhanced adhesion to polymeric materials and method of fabrication
App 20020011656 - Swanson, Leland S. ; et al. | 2002-01-31 |
Intra-chip AC isolation of RF passive components
Grant 6,261,892 - Swanson July 17, 2 | 2001-07-17 |
SiC sidewall process
Grant 6,262,445 - Swanson , et al. July 17, 2 | 2001-07-17 |
Silicon carbide stop layer in chemical mechanical polishing over metallization layers
Grant 6,255,211 - Olsen , et al. July 3, 2 | 2001-07-03 |
Lightly positively doped silicon wafer anodization process
Grant 6,197,654 - Swanson March 6, 2 | 2001-03-06 |
SiC patterning of porous silicon
Grant 6,103,590 - Swanson , et al. August 15, 2 | 2000-08-15 |
Poly (p-phenyleneneacetylene) light-emitting diodes
Grant 5,352,906 - Shinar , et al. October 4, 1 | 1994-10-04 |
Fabrication of poly(p-phenyleneacetylene) light-emitting diodes
Grant 5,334,539 - Shinar , et al. August 2, 1 | 1994-08-02 |
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