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Patent applications and USPTO patent grants for Swanson; Derek S..The latest application filed is for "heat conductive substrate for integrated circuit package".
Patent | Date |
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Heat conductive substrate for integrated circuit package Grant 9,070,657 - Pham , et al. June 30, 2 | 2015-06-30 |
Heat Conductive Substrate For Integrated Circuit Package App 20150097280 - Pham; Tim V. ;   et al. | 2015-04-09 |
Recessed Semiconductor Die Stack App 20150069624 - Pham; Tim V. ;   et al. | 2015-03-12 |
Devices and methods for configuring conductive elements for a semiconductor package Grant 8,754,518 - Carpenter , et al. June 17, 2 | 2014-06-17 |
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