Swan; Johanna

Patent Applications and Registrations

Patent applications and USPTO patent grants for Swan; Johanna.The latest application filed is for "zero-misalignment two-via structures".

Company Profile

27.47.88

Swan; Johanna - Scottsdale AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Technologies for providing a cognitive capacity test for autonomous driving Grant 11,422,551 - Swan , et al. August 23, 2	2022-08-23
Thermal management solutions for substrates in integrated circuit packages Grant 11,417,586 - Elsherbini , et al. August 16, 2	2022-08-16
Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements Grant 11,394,094 - Kamgaing , et al. July 19, 2	2022-07-19
Thermal management solutions for embedded integrated circuit devices Grant 11,342,243 - Eid , et al. May 24, 2	2022-05-24
Waveguide coupling systems and methods Grant 11,309,619 - Oster , et al. April 19, 2	2022-04-19
Heat dissipation device having a thermally conductive structure and a thermal isolation structure in the thermally conductive structure Grant 11,302,599 - Eid , et al. April 12, 2	2022-04-12
Thermal management solutions for stacked integrated circuit devices using jumping drops vapor chambers Grant 11,282,812 - Elsherbini , et al. March 22, 2	2022-03-22
Zero-misalignment Two-via Structures App 20220084931 - STRONG; Veronica ; et al.	2022-03-17
Composite Interposer Structure And Method Of Providing Same App 20220084949 - Elsherbini; Adel ; et al.	2022-03-17
Composite interposer structure and method of providing same Grant 11,270,947 - Elsherbini , et al. March 8, 2	2022-03-08
Heat Dissipation Device Having Anisotropic Thermally Conductive Sections And Isotropic Thermally Conductive Sections App 20220042750 - Eid; Feras ; et al.	2022-02-10
Vias In Composite Ic Chip Structures App 20220037281 - Elsherbini; Adel ; et al.	2022-02-03
Thermal management solutions for stacked integrated circuit devices using unidirectional heat transfer devices Grant 11,234,343 - Eid , et al. January 25, 2	2022-01-25
Mixed Hybrid Bonding Structures And Methods Of Forming The Same App 20220020716 - Liff; Shawna ; et al.	2022-01-20
Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections Grant 11,226,162 - Eid , et al. January 18, 2	2022-01-18
Zero-misalignment two-via structures Grant 11,222,836 - Strong , et al. January 11, 2	2022-01-11
High-throughput Additively Manufactured Power Delivery Vias And Traces App 20210407903 - Elsherbini; Adel ; et al.	2021-12-30
Additive Manufacturing For Integrated Circuit Assembly Connector Support Structures App 20210398715 - Elsherbini; Adel ; et al.	2021-12-23
Power Delivery Structures App 20210398895 - Elsherbini; Adel ; et al.	2021-12-23
Vias in composite IC chip structures Grant 11,205,630 - Elsherbini , et al. December 21, 2	2021-12-21
Composite Ic Chips Including A Chiplet Embedded Within Metallization Layers Of A Host Ic Chip App 20210375830 - Elsherbini; Adel ; et al.	2021-12-02
Selective recess of interconnects for probing hybrid bond devices Grant 11,189,585 - Mueller , et al. November 30, 2	2021-11-30
Mixed hybrid bonding structures and methods of forming the same Grant 11,183,477 - Liff , et al. November 23, 2	2021-11-23
High-density Interconnects For Integrated Circuit Packages App 20210358855 - Strong; Veronica ; et al.	2021-11-18
Interconnection Structure Fabrication Using Grayscale Lithography App 20210343635 - Swan; Johanna ; et al.	2021-11-04
High-density interconnects for integrated circuit packages Grant 11,133,263 - Strong , et al. September 28, 2	2021-09-28
Heat Spreading Layer Integrated Within A Composite Ic Die Structure And Methods Of Forming The Same App 20210280492 - Liff; Shawna ; et al.	2021-09-09
Semiconductor Package Including A Modular Side Radiating Waveguide Launcher App 20210265288 - DOGIAMIS; GEORGIOS ; et al.	2021-08-26
Interconnection structure fabrication using grayscale lithography Grant 11,101,205 - Swan , et al. August 24, 2	2021-08-24
Composite IC chips including a chiplet embedded within metallization layers of a host IC chip Grant 11,094,672 - Elsherbini , et al. August 17, 2	2021-08-17
Heat Spreading Layer Integrated Within A Composite Ic Die Structure And Methods Of Forming The Same App 20210202347 - Liff; Shawna ; et al.	2021-07-01
Skip Level Vias In Metallization Layers For Integrated Circuit Devices App 20210202377 - Elsherbini; Adel ; et al.	2021-07-01
Heat spreading layer integrated within a composite IC die structure and methods of forming the same Grant 11,049,791 - Liff , et al. June 29, 2	2021-06-29
Multiplexer And Combiner Structures Embedded In A Mmwave Connector Interface App 20210194106 - KAMGAING; Telesphor ; et al.	2021-06-24
Selective Recess Of Interconnects For Probing Hybrid Bond Devices App 20210175192 - Mueller; Brennen K. ; et al.	2021-06-10
Composite Interposer Structure And Method Of Providing Same App 20210159179 - Elsherbini; Adel ; et al.	2021-05-27
Selective Interconnects In Back-end-of-line Metallization Stacks Of Integrated Circuitry App 20210159163 - Liff; Shawna ; et al.	2021-05-27
Packaged device with a chiplet comprising memory resources Grant 10,998,302 - Elsherbini , et al. May 4, 2	2021-05-04
Organic interposers for integrated circuit packages Grant 10,998,272 - Aleksov , et al. May 4, 2	2021-05-04
Multiplexer and combiner structures embedded in a mmwave connector interface Grant 10,992,016 - Kamgaing , et al. April 27, 2	2021-04-27
Packaged Device With A Chiplet Comprising Memory Resources App 20210098440 - Elsherbini; Adel ; et al.	2021-04-01
Vias In Composite Ic Chip Structures App 20210098407 - Elsherbini; Adel ; et al.	2021-04-01
Mixed Hybrid Bonding Structures And Methods Of Forming The Same App 20210098411 - Liff; Shawna ; et al.	2021-04-01
Composite Ic Chips Including A Chiplet Embedded Within Metallization Layers Of A Host Ic Chip App 20210098422 - Elsherbini; Adel ; et al.	2021-04-01
Dual Sided Thermal Management Solutions For Integrated Circuit Packages App 20210080500 - Braunisch; Henning ; et al.	2021-03-18
High-density Interconnects For Integrated Circuit Packages App 20210082825 - Strong; Veronica ; et al.	2021-03-18
Organic Interposers For Integrated Circuit Packages App 20210082822 - Aleksov; Aleksandar ; et al.	2021-03-18
Interconnection Structure Fabrication Using Grayscale Lithography App 20210074620 - Swan; Johanna ; et al.	2021-03-11
Reconstituted wafer assembly Grant 10,943,851 - Elsherbini , et al. March 9, 2	2021-03-09
Zero-misalignment Two-via Structures App 20200294901 - STRONG; Veronica ; et al.	2020-09-17
Piezoelectric package-integrated acoustic transducer devices Grant 10,721,568 - Dogiamis , et al.	2020-07-21
Package With Improved Thermals App 20200203298 - Eid; Feras ; et al.	2020-06-25
Flexible electronic system with wire bonds Grant 10,685,949 - Aleksov , et al.	2020-06-16
Mmwave Dielectric Waveguide Interconnect Topology For Automotive Applications App 20200168972 - DOGIAMIS; Georgios ; et al.	2020-05-28
Thermal Management Solutions For Embedded Integrated Circuit Devices App 20200098668 - Eid; Feras ; et al.	2020-03-26
Thermal Management Solutions For Substrates In Integrated Circuit Packages App 20200098669 - Elsherbini; Adel ; et al.	2020-03-26
Thermal Management Solutions For Embedded Integrated Circuit Devices App 20200083135 - Swan; Johanna ; et al.	2020-03-12
Mmwave Waveguide To Waveguide Connectors For Automotive Applications App 20200076040 - DOGIAMIS; Georgios ; et al.	2020-03-05
Thermal Management Solutions For Stacked Integrated Circuit Devices App 20200043829 - Elsherbini; Adel ; et al.	2020-02-06
Thermal Management Solutions That Reduce Inductive Coupling Between Stacked Integrated Circuit Devices App 20200027811 - Eid; Feras ; et al.	2020-01-23
Thermal Management Solutions That Reduce Inductive Coupling Between Stacked Integrated Circuit Devices App 20200027812 - Eid; Feras ; et al.	2020-01-23
Thermal Management Solutions For Stacked Integrated Circuit Devices Using Jumping Drops Vapor Chambers App 20190393193 - Eid; Feras ; et al.	2019-12-26
Thermal Management Solutions For Stacked Integrated Circuit Devices Using Jumping Drops Vapor Chambers App 20190393131 - Eid; Feras ; et al.	2019-12-26
Thermal Management Solutions For Stacked Integrated Circuit Devices Using Jumping Drops Vapor Chambers App 20190393192 - Eid; Feras ; et al.	2019-12-26
Thermal Management Solutions For Stacked Integrated Circuit Devices App 20190385933 - Eid; Feras ; et al.	2019-12-19
Thermal Management Solutions For Stacked Integrated Circuit Devices App 20190385931 - Eid; Feras ; et al.	2019-12-19
Thermal Management Solutions For Stacked Integrated Circuit Devices App 20190385932 - Eid; Feras ; et al.	2019-12-19
Semiconductor package with air pressure sensor Grant 10,508,961 - Lin , et al. Dec	2019-12-17
Multiplexer And Combiner Structures Embedded In A Mmwave Connector Interface App 20190348738 - KAMGAING; Telesphor ; et al.	2019-11-14
Thermal Management Solutions For Stacked Integrated Circuit Devices Using Unidirectional Heat Transfer Devices App 20190343017 - Eid; Feras ; et al.	2019-11-07
Heat Dissipation Device Having Anisotropic Thermally Conductive Sections And Isotropic Thermally Conductive Sections App 20190323785 - Eid; Feras ; et al.	2019-10-24
Heat Dissipation Device Having A Thermally Conductive Structure And A Thermal Isolation Structure In The Thermally Conductive St App 20190326192 - Eid; Feras ; et al.	2019-10-24
Package MEMS switch and method Grant 10,453,635 - Ma , et al. Oc	2019-10-22
Angle Mount Mm-wave Semiconductor Package App 20190200451 - OSTER; SASHA ; et al.	2019-06-27
Waveguide Coupling Systems And Methods App 20190190119 - OSTER; SASHA ; et al.	2019-06-20
Millimeter Wave Waveguide Connector With Integrated Waveguide Structuring App 20190190106 - KAMGAING; TELESPHOR ; et al.	2019-06-20
Piezoelectric Package-integrated Acoustic Transducer Devices App 20190141456 - DOGIAMIS; Georgios C. ; et al.	2019-05-09
Technologies For Providing A Cognitive Capacity Test For Autonomous Driving App 20190129418 - Swan; Johanna ; et al.	2019-05-02
Technologies For Providing Guidance For Autonomous Vehicles In Areas Of Low Network Connectivity App 20190130743 - Dabby; Nadine ; et al.	2019-05-02
Multi-chip-module semiconductor chip package having dense package wiring Grant 10,256,211 - Hu , et al.	2019-04-09
Methods And Apparatus For Detecting Emergency Events Based On Vehicle Occupant Behavior Data App 20190047578 - Swan; Johanna ; et al.	2019-02-14
Technologies For On-demand Ad Hoc Cooperation For Autonomous Vehicles In Emergency Situations App 20190051188 - Moustafa; Hassnaa ; et al.	2019-02-14
Flexible electronic assembly method Grant 9,820,384 - Oster , et al. November 14, 2	2017-11-14
Optical interconnect on bumpless build-up layer package Grant 9,800,015 - Eid , et al. October 24, 2	2017-10-24
Package MEMS switch and method Grant 9,691,579 - Ma , et al. June 27, 2	2017-06-27
Flexible Electronic System With Wire Bonds App 20170179103 - Aleksov; Aleksandar ; et al.	2017-06-22
Integrated circuit and method that utilize a shape memory material Grant 9,635,764 - Qiu , et al. April 25, 2	2017-04-25
Integrated Circuit And Method That Utilize A Shape Memory Material App 20170094799 - Qiu; Shipeng ; et al.	2017-03-30
Flexible electronic system with wire bonds Grant 9,591,758 - Aleksov , et al. March 7, 2	2017-03-07
Multi-chip-module Semiconductor Chip Package Having Dense Package Wiring App 20160293578 - Hu; Chuan ; et al.	2016-10-06
Optical Interconnect On Bumpless Build-up Layer Package App 20160254641 - Eid; Feras ; et al.	2016-09-01
Accelerometer And Method Of Making Same App 20160245841 - MA; Qing ; et al.	2016-08-25
Architecture for seamless integrated display system Grant 9,361,059 - Swan , et al. June 7, 2	2016-06-07
Techniques, systems and devices related to acceleration measurement Grant 9,297,824 - Ma , et al. March 29, 2	2016-03-29
Semiconductor Package With Air Pressure Sensor App 20160076961 - Lin; Kevin L. ; et al.	2016-03-17
Optical interconnect on bumpless build-up layer package Grant 9,275,969 - Eid , et al. March 1, 2	2016-03-01
Package Mems Switch And Method App 20160020051 - Ma; Qing ; et al.	2016-01-21
Semiconductor package with air pressure sensor Grant 9,200,973 - Lin , et al. December 1, 2	2015-12-01
Flexible Electronic System With Wire Bonds App 20150282321 - Aleksov; Aleksandar Aleks ; et al.	2015-10-01
Flexible Electronic Assembly And Method App 20150163921 - Oster; Sasha ; et al.	2015-06-11
Architecture For Seamless Integrated Display System App 20140168032 - Swan; Johanna ; et al.	2014-06-19
Optical Interconnect On Bumpless Build-up Layer Package App 20140169800 - Eid; Feras ; et al.	2014-06-19
Accelerometer And Method Of Making Same App 20140076051 - MA; Qing ; et al.	2014-03-20
Semiconductor Package With Air Pressure Sensor App 20140000377 - Lin; Kevin L. ; et al.	2014-01-02
Method of mounting an optical device Grant 8,230,589 - Lu , et al. July 31, 2	2012-07-31
Silicon interposer-based hybrid voltage regulator system for VLSI devices Grant 7,952,194 - Nair , et al. May 31, 2	2011-05-31
Thinned die integrated circuit package Grant 7,888,183 - Liu , et al. February 15, 2	2011-02-15
Securing integrated circuit dice to substrates App 20090321955 - Houle; Sabina ; et al.	2009-12-31
Optical Package App 20090244873 - LU; Daoqiang ; et al.	2009-10-01
Thinned die integrated circuit package Grant 7,420,273 - Liu , et al. September 2, 2	2008-09-02
Optoelectrical package Grant 7,418,163 - Chakravorty , et al. August 26, 2	2008-08-26
Thinned Die Integrated Circuit Package App 20080153209 - Liu; Cheng-Yi ; et al.	2008-06-26
Stackable integrated circuit packaging Grant 7,345,361 - Mallik , et al. March 18, 2	2008-03-18
Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board Grant 7,049,704 - Chakravorty , et al. May 23, 2	2006-05-23
Thinned die integrated circuit package App 20050121778 - Liu, Cheng-Yi ; et al.	2005-06-09
Stackable integrated circuit packaging App 20050121764 - Mallik, Debendra ; et al.	2005-06-09
Thinned die integrated circuit package Grant 6,841,413 - Liu , et al. January 11, 2	2005-01-11
Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board App 20040208416 - Chakravorty, Kishore K. ; et al.	2004-10-21
Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board Grant 6,754,407 - Chakravorty , et al. June 22, 2	2004-06-22
Integrated optoelectrical circuit package with optical waveguide interconnects App 20030185484 - Chakravorty, Kishore K. ; et al.	2003-10-02
Thinned die integrated circuit package App 20030127715 - Liu, Cheng-Yi ; et al.	2003-07-10
Silicon interposer-based hybrid voltage regulator system for VLSI devices App 20030081389 - Nair, Raj ; et al.	2003-05-01
Flip-chip package integrating optical and electrical devices and coupling to a waveguide on a board App 20030002770 - Chakravorty, Kishore K. ; et al.	2003-01-02

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