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Modeling of Power Distribution Networks for Path Finding
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System And Method For Enhancing Bandwidth Of Low-dropout Regulators Using Power Transmission Lines For High Speed Input Output D
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Modeling TSV interposer considering depletion capacitance and substrate effects
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Modeling of Power Distribution Networks for Path Finding
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Modeling TSV Interposer Considering Depletion Capacitance and Substrate Effects
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Modeling electrical interconnections in three-dimensional structures
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Heterogeneous organic laminate stack ups for high frequency applications
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Multi-layer finite element method for modeling of package power and ground planes
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Modeling of Multi-Layered Power/Ground Planes using Triangle Elements
App 20120150523 - Choi; Jae Young ; et al. | 2012-06-14 |
Electrical-Thermal Co-Simulation with Joule Heating and Convection Effects for 3D Systems
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Systems and methods for electromagnetic band gap structure synthesis
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Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications
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Multilayer finite difference methods for electrical modeling of packages and printed circuit boards
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Liquid Crystalline Polymer and Multilayer Polymer-Based Passive Signal Processing Components for RF/Wireless Multi-Band Applications
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Method for fabricating three-dimensional all organic interconnect structures
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Liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications
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Multi-Layer Finite Element Method for Modeling of Package Power and Ground Planes
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Multilayer finite difference methods for electrical modeling of packages and printed circuit boards
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Ferroelectrics and ferromagnetics for noise isolation in integrated circuits, packaging, and system architectures
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Device having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry of an integrated circuit
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Modeling electrical interconnections in three-dimensional structures
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Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof
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Systems And Methods For Electromagnetic Band Gap Structure Synthesis
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Methods for Fabricating Three-Dimensional All Organic Interconnect Structures
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Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof
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Package having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuit and methods of forming thereof
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Integrated passive devices fabricated utilizing multi-layer, organic laminates
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Integrated passive devices fabricated utilizing multi-layer, organic laminates
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Integrated passive devices fabricated utilizing multi-layer, organic laminates
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