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Patent applications and USPTO patent grants for Svedin; Niklas.The latest application filed is for "thin capping for mems devices".
Patent | Date |
---|---|
Thin capping for MEMS devices Grant 9,718,674 - Kalvesten , et al. August 1, 2 | 2017-08-01 |
Thin film capping Grant 9,511,999 - Ebefors , et al. December 6, 2 | 2016-12-06 |
Via structure and method thereof Grant 9,448,401 - Ebefors , et al. September 20, 2 | 2016-09-20 |
Thin Capping For Mems Devices App 20160207758 - KALVESTEN; Edvard ;   et al. | 2016-07-21 |
Thin Film Capping App 20140346657 - Ebefors; Thorbjorn ;   et al. | 2014-11-27 |
Bonding process and bonded structures Grant 8,866,289 - Ebefors , et al. October 21, 2 | 2014-10-21 |
Bonding process and bonded structures Grant 8,729,685 - Ebefors , et al. May 20, 2 | 2014-05-20 |
Via structure and method thereof Grant 8,729,713 - Ebefors , et al. May 20, 2 | 2014-05-20 |
Via Structure And Method Thereof App 20140063580 - Ebefors; Thorbjorn ;   et al. | 2014-03-06 |
Via structure and method thereof Grant 8,630,033 - Ebefors , et al. January 14, 2 | 2014-01-14 |
Via structure and method thereof Grant 8,592,981 - Ebefors , et al. November 26, 2 | 2013-11-26 |
Bonding process and bonded structures Grant 8,485,416 - Ebefors , et al. July 16, 2 | 2013-07-16 |
Novel Bonding Process And Bonded Structures App 20120112335 - EBEFORS; Thorbjorn ;   et al. | 2012-05-10 |
Novel Bonding Process And Bonded Structures App 20120097733 - EBEFORS; Thorbjorn ;   et al. | 2012-04-26 |
Novel Bonding Process And Bonded Structures App 20120076715 - Ebefors; Thorbjorn ;   et al. | 2012-03-29 |
Via Structure And Method Thereof App 20120019886 - Ebefors; Thorbjorn ;   et al. | 2012-01-26 |
Via Structure And Method Thereof App 20120018898 - Ebefors; Thorbjorn ;   et al. | 2012-01-26 |
Via Structure And Method Thereof App 20120018852 - Ebefors; Thorbjorn ;   et al. | 2012-01-26 |
Electrical connections in substrates Grant 7,560,802 - Kalvesten , et al. July 14, 2 | 2009-07-14 |
Deflectable microstructure and method of manufacturing the same through bonding of wafers Grant 7,172,911 - Kalvesten , et al. February 6, 2 | 2007-02-06 |
Deflectable microstructure and method of manufacturing the same through bonding of wafers App 20050124159 - Kalvesten, Edvard ;   et al. | 2005-06-09 |
Lift force fluid flow sensor for measuring fluid flow velocities Grant 6,055,869 - Stemme , et al. May 2, 2 | 2000-05-02 |
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