loadpatents
name:-0.011370182037354
name:-0.013686180114746
name:-0.00035786628723145
Svedin; Niklas Patent Filings

Svedin; Niklas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Svedin; Niklas.The latest application filed is for "thin capping for mems devices".

Company Profile
0.18.10
  • Svedin; Niklas - Stockholm SE
  • Svedin; Niklas - Karlavagen SE
  • Svedin; Niklas - S-11432 Stockholm SE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Thin capping for MEMS devices
Grant 9,718,674 - Kalvesten , et al. August 1, 2
2017-08-01
Thin film capping
Grant 9,511,999 - Ebefors , et al. December 6, 2
2016-12-06
Via structure and method thereof
Grant 9,448,401 - Ebefors , et al. September 20, 2
2016-09-20
Thin Capping For Mems Devices
App 20160207758 - KALVESTEN; Edvard ;   et al.
2016-07-21
Thin Film Capping
App 20140346657 - Ebefors; Thorbjorn ;   et al.
2014-11-27
Bonding process and bonded structures
Grant 8,866,289 - Ebefors , et al. October 21, 2
2014-10-21
Bonding process and bonded structures
Grant 8,729,685 - Ebefors , et al. May 20, 2
2014-05-20
Via structure and method thereof
Grant 8,729,713 - Ebefors , et al. May 20, 2
2014-05-20
Via Structure And Method Thereof
App 20140063580 - Ebefors; Thorbjorn ;   et al.
2014-03-06
Via structure and method thereof
Grant 8,630,033 - Ebefors , et al. January 14, 2
2014-01-14
Via structure and method thereof
Grant 8,592,981 - Ebefors , et al. November 26, 2
2013-11-26
Bonding process and bonded structures
Grant 8,485,416 - Ebefors , et al. July 16, 2
2013-07-16
Novel Bonding Process And Bonded Structures
App 20120112335 - EBEFORS; Thorbjorn ;   et al.
2012-05-10
Novel Bonding Process And Bonded Structures
App 20120097733 - EBEFORS; Thorbjorn ;   et al.
2012-04-26
Novel Bonding Process And Bonded Structures
App 20120076715 - Ebefors; Thorbjorn ;   et al.
2012-03-29
Via Structure And Method Thereof
App 20120019886 - Ebefors; Thorbjorn ;   et al.
2012-01-26
Via Structure And Method Thereof
App 20120018898 - Ebefors; Thorbjorn ;   et al.
2012-01-26
Via Structure And Method Thereof
App 20120018852 - Ebefors; Thorbjorn ;   et al.
2012-01-26
Electrical connections in substrates
Grant 7,560,802 - Kalvesten , et al. July 14, 2
2009-07-14
Deflectable microstructure and method of manufacturing the same through bonding of wafers
Grant 7,172,911 - Kalvesten , et al. February 6, 2
2007-02-06
Deflectable microstructure and method of manufacturing the same through bonding of wafers
App 20050124159 - Kalvesten, Edvard ;   et al.
2005-06-09
Lift force fluid flow sensor for measuring fluid flow velocities
Grant 6,055,869 - Stemme , et al. May 2, 2
2000-05-02

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