| Patent | Date |
|---|
Controller, control system and ladder program
Grant 11,254,001 - Suzuki February 22, 2 | 2022-02-22 |
Pump Mechanism And Beverage Dispenser
App 20200062573 - SUZUKI; Yuuji ; et al. | 2020-02-27 |
Container
Grant 10,518,938 - Suzuki , et al. Dec | 2019-12-31 |
Controller, Control System And Ladder Program
App 20190366540 - SUZUKI; Yuuji | 2019-12-05 |
Robot system
Grant 10,160,119 - Suzuki Dec | 2018-12-25 |
Container
App 20180079559 - SUZUKI; Yuuji ; et al. | 2018-03-22 |
Liquid Dispenser
App 20180065838 - SUZUKI; Yuuji ; et al. | 2018-03-08 |
Robot System
App 20170282378 - SUZUKI; Yuuji | 2017-10-05 |
Sheet processing apparatus, image forming system, and sheet folding method
Grant 9,102,117 - Suzuki , et al. August 11, 2 | 2015-08-11 |
Display device
Grant 9,078,341 - Suzuki July 7, 2 | 2015-07-07 |
Sheet processing apparatus and image forming system
Grant 9,016,679 - Kunieda , et al. April 28, 2 | 2015-04-28 |
Sheet Processing Apparatus And Image Forming System
App 20140147184 - KUNIEDA; Akira ; et al. | 2014-05-29 |
Sheet Processing Apparatus, Image Forming System, And Sheet Folding Method
App 20140141956 - SUZUKI; Yuuji ; et al. | 2014-05-22 |
Display Device
App 20130300975 - SUZUKI; Yuuji | 2013-11-14 |
Surface treated electrodeposited copper foil and circuit board
Grant 8,153,273 - Saito , et al. April 10, 2 | 2012-04-10 |
Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
Grant 7,985,485 - Moteki , et al. July 26, 2 | 2011-07-26 |
Ultrathin copper foil with carrier and printed circuit board using same
Grant 7,985,488 - Suzuki , et al. July 26, 2 | 2011-07-26 |
Copper Foil For High Frequency Circuit, Method Of Production And Apparatus For Production Of Same, And High Frequency Circuit Using Copper Foil
App 20110171486 - MOTEKI; Takami ; et al. | 2011-07-14 |
Laminated circuit board
Grant 7,976,956 - Suzuki , et al. July 12, 2 | 2011-07-12 |
Ultrathin copper foil with carrier and printed circuit board using same
Grant 7,892,655 - Suzuki , et al. February 22, 2 | 2011-02-22 |
Ultrathin Copper Foil With Carrier And Printed Circuit Board Using Same
App 20100270063 - Suzuki; Yuuji ; et al. | 2010-10-28 |
Method for preparing a circuit board material having a conductive base and a resistance layer
Grant 7,794,578 - Matsuda , et al. September 14, 2 | 2010-09-14 |
Ultrathin copper foil with carrier and printed circuit board using same
Grant 7,771,841 - Suzuki , et al. August 10, 2 | 2010-08-10 |
Copper Foil For High Frequency Circuit, Method Of Production And Apparatus For Production Of Same, And High Frequency Circuit Using Copper Foil
App 20090324988 - Moteki; Takami ; et al. | 2009-12-31 |
Static Crushing Method, Aid for Static Crushing Used for the Crushing Method, and Filling Tool
App 20090289492 - Sakaki; Tetsuya ; et al. | 2009-11-26 |
Treated copper foil and circuit board
Grant 7,381,475 - Suzuki June 3, 2 | 2008-06-03 |
Disk Drive Device
App 20080005759 - OMORI; Kiyoshi ; et al. | 2008-01-03 |
Surface treated electrodeposited copper foil, the production method and circuit board
App 20070287020 - Saito; Takahiro ; et al. | 2007-12-13 |
Conductive Base Material With Thin Film Resistance Layer, Method Of Production Of Conductive Base Material With Thin Film Resistance Layer, And Circuit Board With Thin Film Resistance Layer
App 20070228443 - KIKUCHI; Yuuki ; et al. | 2007-10-04 |
Braking system of hybrid vehicle
Grant 7,275,795 - Nishina , et al. October 2, 2 | 2007-10-02 |
Ultrathin Copper Foil With Carrier And Printed Circuit Board Using Same
App 20070154692 - Suzuki; Yuuji ; et al. | 2007-07-05 |
Ultrathin copper foil with carrier and printed circuit board using same
App 20070141381 - Suzuki; Yuuji ; et al. | 2007-06-21 |
Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board
Grant 7,223,481 - Suzuki , et al. May 29, 2 | 2007-05-29 |
Laminated circuit board
App 20070110969 - Suzuki; Yuuji ; et al. | 2007-05-17 |
Conductive substrate with resistance layer, resistance board, and resistance circuit board
Grant 7,215,235 - Matsuda , et al. May 8, 2 | 2007-05-08 |
Laminated Circuit Board
App 20070048507 - SUZUKI; Yuuji ; et al. | 2007-03-01 |
Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
App 20070042212 - Moteki; Takami ; et al. | 2007-02-22 |
Semiconductor integrated circuit device
Grant 7,078,928 - Sahara , et al. July 18, 2 | 2006-07-18 |
Composite copper foil, method of production thereof and high frequency transmission circuit using said composite copper foil
App 20060147742 - Matsuda; Akira ; et al. | 2006-07-06 |
Surface treated copper foil and circuit board
App 20060088723 - Suzuki; Yuuji | 2006-04-27 |
Conductive base material with resistance layer and circuit board material with resistance layer
App 20050280498 - Kikuchi, Yuuki ; et al. | 2005-12-22 |
Braking system of hybrid vehicle
App 20050218717 - Nishina, Mitsuhiro ; et al. | 2005-10-06 |
Gateway system having a redundant structure of media gateway controllers
Grant 6,944,280 - Suzuki September 13, 2 | 2005-09-13 |
Ink, production method of the same materials for producing the same and printed matter with the same
Grant 6,939,400 - Suzuki September 6, 2 | 2005-09-06 |
Treated copper foil and circuit board
App 20050175826 - Suzuki, Yuuji | 2005-08-11 |
Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier
Grant 6,924,043 - Suzuki , et al. August 2, 2 | 2005-08-02 |
Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board
App 20050048306 - Suzuki, Yuuji ; et al. | 2005-03-03 |
Copper foil for high frequency circuit, method of production and apparatus for production of same, and high frequency circuit using copper foil
App 20050019599 - Moteki, Takami ; et al. | 2005-01-27 |
Conductive substrate with resistance layer, resistance board, and resistance circuit board
App 20040201446 - Matsuda, Akira ; et al. | 2004-10-14 |
Plating bath for forming thin resistance layer, method of formation of resistance layer, conductive base with resistance layer, and circuit board material with resistance layer
App 20040144656 - Matsuda, Akira ; et al. | 2004-07-29 |
Semiconductor integrated circuit device
App 20040128635 - Sahara, Ryusuke ; et al. | 2004-07-01 |
Ultra-thin copper foil with carrier, method of production of same, and printed circuit board using ultra-thin copper foil with carrier
App 20040121178 - Suzuki, Yuuji ; et al. | 2004-06-24 |
Ink, production method of the same materials for producing the same and printed matter with the same
App 20040103816 - Suzuki, Yuuji | 2004-06-03 |
Gateway system having a redundant structure of media gateway contollers
App 20020027983 - Suzuki, Yuuji | 2002-03-07 |
Air expandable bodies reciprocating a massage element
Grant 6,312,400 - Itikawa , et al. November 6, 2 | 2001-11-06 |
Ink carrier film in use with ink jet recording device
Grant 4,725,860 - Kohyama , et al. February 16, 1 | 1988-02-16 |
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