Suzuki; Takenori
Patent Applications and Registrations
Patent applications and USPTO patent grants for Suzuki; Takenori.The latest application filed is for "substrate joining method".
- Suzuki; Takenori - Tokyo JP
- SUZUKI; Takenori - Ritto-shi JP
- Suzuki; Takenori - Shiga N/A JP
- Suzuki; Takenori - Ritto JP
- SUZUKI; Takenori - Hamamatsu-shi JP
- Suzuki; Takenori - Hamamatsu JP
- Suzuki; Takenori - Hamakita JP
- Suzuki, Takenori - Hamakita-shi JP
- Suzuki; Takenori - Hamamatu JP
| Patent | Date |
|---|---|
| Room-temperature-bonded semiconductor device and manufacturing method of room-temperature-bonded semiconductor device Grant 10,486,263 - Utsumi , et al. Nov | 2019-11-26 |
| Substrate Joining Method App 20190172813 - UTSUMI; Jun ; et al. | 2019-06-06 |
| Semiconductor Device And Manufacturing Method Of Semiconductor Device App 20170355040 - UTSUMI; Jun ; et al. | 2017-12-14 |
| Room-temperature Bonding Apparatus App 20170162428 - KINOUCHI; Masato ; et al. | 2017-06-08 |
| Room temperature bonding apparatus and room temperature bonding method Grant 9,580,306 - Kinouchi , et al. February 28, 2 | 2017-02-28 |
| Room-temperature bonding apparatus Grant 9,443,711 - Kinouchi , et al. September 13, 2 | 2016-09-13 |
| Room Temperature Bonding Apparatus And Room Temperature Bonding Method App 20150251904 - Kinouchi; Masato ; et al. | 2015-09-10 |
| Wafer bonding device and wafer bonding method Grant 9,130,000 - Tsuno , et al. September 8, 2 | 2015-09-08 |
| Room-temperature Bonding Apparatus And Room-temperature Bonding Method App 20150249026 - Tsuno; Takeshi ; et al. | 2015-09-03 |
| Bonding unit control unit and multi-layer bonding method Grant 9,064,910 - Kinouchi , et al. June 23, 2 | 2015-06-23 |
| Room temperature bonding apparatus Grant 9,005,390 - Tsuno , et al. April 14, 2 | 2015-04-14 |
| Room temperature bonding machine and room temperature bonding method Grant 8,985,175 - Kinouchi , et al. March 24, 2 | 2015-03-24 |
| Room temperature bonding apparatus Grant 8,906,175 - Kinouchi , et al. December 9, 2 | 2014-12-09 |
| Room temperature bonding apparatus Grant 8,857,487 - Tsuno , et al. October 14, 2 | 2014-10-14 |
| Room-temperature Bonding Apparatus App 20140224405 - Kinouchi; Masato ; et al. | 2014-08-14 |
| Seal Member App 20130147126 - SATO; Taisuke ; et al. | 2013-06-13 |
| Room Temperature Bonding Apparatus App 20120285624 - TSUNO; Takeshi ; et al. | 2012-11-15 |
| Bonding Method, Bonding Apparatus, And Bonding System App 20120247645 - Tsutsumi; Keiichiro ; et al. | 2012-10-04 |
| Oil pan Grant 8,201,578 - Suzuki , et al. June 19, 2 | 2012-06-19 |
| Bonding Unit Control Unit And Multi-layer Bonding Method App 20120031557 - Kinouchi; Masato ; et al. | 2012-02-09 |
| Room Temperature Bonding Apparatus App 20110277904 - Kinouchi; Masato ; et al. | 2011-11-17 |
| Wafer Bonding Device And Wafer Bonding Method App 20110207291 - Tsuno; Takeshi ; et al. | 2011-08-25 |
| Room Temperature Bonding Machine And Room Temperature Bonding Method App 20110083801 - Kinouchi; Masato ; et al. | 2011-04-14 |
| Room Temperature Bonding Apparatus App 20110011536 - Tsuno; Takeshi ; et al. | 2011-01-20 |
| Oil Pan App 20100018589 - Suzuki; Takenori ; et al. | 2010-01-28 |
| Filter element App 20060169632 - Suzuki; Takenori ; et al. | 2006-08-03 |
| Canister module Grant 6,514,326 - Hara , et al. February 4, 2 | 2003-02-04 |
| Canister having liquefied fuel treating function App 20020026874 - Ikuma, Kouichi ; et al. | 2002-03-07 |
| Fuel vapor capturing canister having increased distance of flow of fuel vapor passing through adsorbent layer Grant 5,645,036 - Matsumoto , et al. July 8, 1 | 1997-07-08 |
| Fuel vapor capturing canister having increased distance of flow of fuel vapor passing through adsorbent layer Grant 5,538,543 - Watanabe , et al. July 23, 1 | 1996-07-23 |
| Fuel vapor capturing canister having increased distance of flow of fuel vapor passing through adsorbent layer Grant 5,538,542 - Watanabe , et al. July 23, 1 | 1996-07-23 |
| Canister Grant 5,304,235 - Watanabe , et al. April 19, 1 | 1994-04-19 |
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