Suzuki; Motoji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Suzuki; Motoji.The latest application filed is for "method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy".

Company Profile

0.10.8

Suzuki; Motoji - Tokyo JP
Suzuki; Motoji - Kasugai JP
Suzuki; Motoji - Okazaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure comprising a printed circuit board with electronic components mounted thereon and a method for manufacturing the same Grant 7,057,293 - Sakai , et al. June 6, 2	2006-06-06
Method of packaging electronic components without creating unnecessary solder balls Grant 7,013,557 - Sakai , et al. March 21, 2	2006-03-21
Method of packaging electronic components with high reliability Grant 6,929,973 - Sakai , et al. August 16, 2	2005-08-16
Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy Grant 6,915,942 - Watanabe , et al. July 12, 2	2005-07-12
Method and apparatus for printing solder paste of different thickness on lands on printed circuit board Grant 6,857,361 - Sakai , et al. February 22, 2	2005-02-22
Circuit board and electronic equipment using the same Grant 6,617,529 - Ishizuka , et al. September 9, 2	2003-09-09
Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy App 20030005581 - Watanabe, Shinji ; et al.	2003-01-09
Printing mask having protrusions with through holes for printing solder paste on lands on printed circuit board App 20020185020 - Sakai, Hiroshi ; et al.	2002-12-12
Method of packaging electronic components with high reliability App 20020185304 - Sakai, Hiroshi ; et al.	2002-12-12
Structure comprising a printed circuit board with electronic components mounted thereon and a method for manufacturing the same App 20020179323 - Sakai, Hiroshi ; et al.	2002-12-05
Solder paste printing method and apparatus for printing solder paste on a board on which wiring patterns are formed App 20020179695 - Sakai, Hiroshi ; et al.	2002-12-05
Method of mounting electronic parts with Sn-Zn solder free of Pb without reduction in bonding strength App 20020179328 - Sakai, Hiroshi ; et al.	2002-12-05
Method of packaging electronic components without creating unnecessary solder balls App 20020179322 - Sakai, Hiroshi ; et al.	2002-12-05
Circuit board and electronic equipment using the same App 20020074164 - Ishizuka, Naomi ; et al.	2002-06-20
Flip-chip resin sealing structure and resin sealing method Grant 6,049,038 - Suzuki April 11, 2	2000-04-11
Tire pressure detecting device which compares driven and driving wheel speeds and acceleration wherein judgment is prohibited when slippage occurs Grant 5,939,626 - Tominaga , et al. August 17, 1	1999-08-17
Printed wiring board Grant 5,925,445 - Suzuki July 20, 1	1999-07-20
Locking and unlocking device Grant 4,252,351 - Yoshino , et al. February 24, 1	1981-02-24

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