SUZUKI; Katsunobu

Patent Applications and Registrations

Patent applications and USPTO patent grants for SUZUKI; Katsunobu.The latest application filed is for "actuator and camera device".

Company Profile

0.14.6

SUZUKI; Katsunobu - Osaka JP
Suzuki; Katsunobu - Kanagawa JP
Suzuki, Katsunobu - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Actuator And Camera Device App 20210165183 - KAMEYAMA; Yasuaki ; et al.	2021-06-03
System in package integrating a plurality of semiconductor chips Grant 7,888,808 - Suzuki , et al. February 15, 2	2011-02-15
System-in-package App 20090140769 - Suzuki; Katsunobu ; et al.	2009-06-04
System in package App 20080151484 - Suzuki; Katsunobu ; et al.	2008-06-26
Package substrate for a semiconductor device having thermoplastic resin layers and conductive patterns Grant 7,378,745 - Hayashi , et al. May 27, 2	2008-05-27
Printed circuit board having colored outer layer Grant 7,323,238 - Kondo , et al. January 29, 2	2008-01-29
Printed board and manufacturing method thereof App 20060068180 - Kondo; Koji ; et al.	2006-03-30
Package substrate for a semiconductor device, a fabrication method for same, and a semiconductor device App 20060044735 - Hayashi; Akimori ; et al.	2006-03-02
Package for semiconductor chip having thin recess portion and thick plane portion App 20020096750 - Suzuki, Katsunobu	2002-07-25
Package for semiconductor chip having thin recess portion and thick plane portion Grant 6,379,996 - Suzuki April 30, 2	2002-04-30
Economical package with built-in end resistor used for semiconductor device and process of fabrication Grant 6,150,615 - Suzuki November 21, 2	2000-11-21
Semiconductor device and method of forming the same Grant 6,111,311 - Suzuki August 29, 2	2000-08-29
Package for a semiconductor device and a semiconductor device Grant 6,028,358 - Suzuki February 22, 2	2000-02-22
Semiconductor device with metal base substrate having hollows Grant 5,977,633 - Suzuki , et al. November 2, 1	1999-11-02
Package for a semiconductor device Grant 5,889,324 - Suzuki March 30, 1	1999-03-30
Semiconductor device and method of manufacturing the same Grant 5,889,325 - Uchida , et al. March 30, 1	1999-03-30
Metal base package for a semiconductor device Grant 5,866,942 - Suzuki , et al. February 2, 1	1999-02-02
Plastic molded IC package with leads having small flatness fluctuation Grant 5,844,307 - Suzuki , et al. December 1, 1	1998-12-01
Semiconductor device having semiconductor chip mounted in package having cavity and method for fabricating the same Grant 5,783,426 - Suzuki , et al. July 21, 1	1998-07-21
Package for packaging a semiconductor device suitable for being connected to a connection object by soldering Grant 5,600,179 - Suzuki February 4, 1	1997-02-04

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