Sutton; Benjamin Michael

Patent Applications and Registrations

Patent applications and USPTO patent grants for Sutton; Benjamin Michael.The latest application filed is for "cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies".

Company Profile

6.7.9

Sutton; Benjamin Michael - Dallas TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Cantilevered Leadframe Support Structure for Magnetic Wireless Transfer between Integrated Circuit Dies App 20210249336 - Sutton; Benjamin Michael ; et al.	2021-08-12
Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies Grant 10,991,641 - Sutton , et al. April 27, 2	2021-04-27
Embedded coil assembly and method of making Grant 10,978,239 - Li , et al. April 13, 2	2021-04-13
Embedded coil assembly and method of making Grant 10,854,370 - Li , et al. December 1, 2	2020-12-01
Cantilevered Leadframe Support Structure for Magnetic Wireless Transfer between Integrated Circuit Dies App 20200266131 - Sutton; Benjamin Michael ; et al.	2020-08-20
Cantilevered leadframe support structure for magnetic wireless transfer between integrated circuit dies Grant 10,643,929 - Sutton , et al.	2020-05-05
Embedded coil assembly and production method Grant 10,256,027 - Li , et al.	2019-04-09
Embedded Coil Assembly And Method Of Making App 20180336994 - Li; Haiying ; et al.	2018-11-22
Embedded coil assembly and method of making Grant 9,824,811 - Li , et al. November 21, 2	2017-11-21
Embedded Coil Assembly And Method Of Making App 20170294263 - Li; Haiying ; et al.	2017-10-12
Integrated circuit package and method Grant 9,527,728 - Romig , et al. December 27, 2	2016-12-27
Embedded Coil Assembly And Method Of Making App 20160181003 - Li; Haiying ; et al.	2016-06-23
Embedded Coil Assembly And Production Method App 20160181004 - Li; Haiying ; et al.	2016-06-23
Integrated Circuit Package Method App 20160096727 - Romig; Matthew David ; et al.	2016-04-07
Cantilevered Leadframe Support Structure for Magnetic Wireless Transfer Between Integrated Circuit Dies App 20150325501 - Sutton; Benjamin Michael ; et al.	2015-11-12
Integrated Circuit Package And Method App 20150021721 - Romig; Matthew David ; et al.	2015-01-22

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