Suthiwongsunthorn; Nathapong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Suthiwongsunthorn; Nathapong.The latest application filed is for "semiconductor packages and methods of packaging semiconductor devices".

Company Profile

2.46.38

Suthiwongsunthorn; Nathapong - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor packages and methods for forming semiconductor package Grant 10,381,280 - Suthiwongsunthorn , et al. A	2019-08-13
Semiconductor packages and methods of packaging semiconductor devices Grant 10,354,934 - Suthiwongsunthorn , et al. July 16, 2	2019-07-16
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20180240726 - SUTHIWONGSUNTHORN; Nathapong ; et al.	2018-08-23
Semiconductor packages and methods of packaging semiconductor devices Grant 9,978,658 - Suthiwongsunthorn , et al. May 22, 2	2018-05-22
Semiconductor packages and methods of packaging semiconductor devices Grant 9,881,863 - Wang , et al. January 30, 2	2018-01-30
Semiconductor device and method of forming a thin wafer without a carrier Grant 9,842,775 - Marimuthu , et al. December 12, 2	2017-12-12
Semiconductor Packages And Methods For Forming Semiconductor Package App 20170294401 - SUTHIWONGSUNTHORN; Nathapong ; et al.	2017-10-12
Methods for singulating semiconductor wafer Grant 9,741,619 - Nelson , et al. August 22, 2	2017-08-22
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20170148722 - WANG; Chuen Khiang ; et al.	2017-05-25
Methods For Singulating Semiconductor Wafer App 20170117185 - NELSON; William John ; et al.	2017-04-27
Semiconductor packages and methods for forming semiconductor package Grant 9,613,877 - Suthiwongsunthorn , et al. April 4, 2	2017-04-04
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20170077007 - SUTHIWONGSUNTHORN; Nathapong ; et al.	2017-03-16
Semiconductor packages and methods of packaging semiconductor devices Grant 9,589,875 - Wang , et al. March 7, 2	2017-03-07
Semiconductor device and method of forming a shielding layer between stacked semiconductor die Grant 9,583,446 - Pagaila , et al. February 28, 2	2017-02-28
Methods for singulating semiconductor wafer Grant 9,570,314 - Nelson , et al. February 14, 2	2017-02-14
Semiconductor packages and methods of packaging semiconductor devices Grant 9,508,623 - Suthiwongsunthorn , et al. November 29, 2	2016-11-29
Semiconductor Device and Method of Forming a Thin Wafer Without a Carrier App 20160336230 - Marimuthu; Pandi C. ; et al.	2016-11-17
Leadframe area array packaging technology Grant 9,472,532 - Dimaano, Jr. , et al. October 18, 2	2016-10-18
Semiconductor device and method of forming a thin wafer without a carrier Grant 9,443,762 - Marimuthu , et al. September 13, 2	2016-09-13
Methods For Singulating Semiconductor Wafer App 20160104626 - NELSON; William John ; et al.	2016-04-14
Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die Grant 9,236,352 - Pagaila , et al. January 12, 2	2016-01-12
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20150380346 - WANG; Chuen Khiang ; et al.	2015-12-31
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20150357256 - SUTHIWONGSUNTHORN; Nathapong ; et al.	2015-12-10
Semiconductor packages and methods of packaging semiconductor devices Grant 9,136,142 - Wang , et al. September 15, 2	2015-09-15
Leadframe Area Array Packaging Technology App 20150214187 - Dimaano, JR.; Antonio Bambalan ; et al.	2015-07-30
Semiconductor device and method of making TSV interconnect structures using encapsulant for structural support Grant 9,054,083 - Suthiwongsunthorn , et al. June 9, 2	2015-06-09
Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support Grant 9,029,193 - Marimuthu , et al. May 12, 2	2015-05-12
Leadframe area array packaging technology Grant 9,023,690 - Dimaano, Jr. , et al. May 5, 2	2015-05-05
Semiconductor Device and Method of Forming a Shielding Layer Between Stacked Semiconductor Die App 20150115394 - Pagaila; Reza A. ; et al.	2015-04-30
Semiconductor Packages And Methods For Forming Semiconductor Package App 20150102478 - SUTHIWONGSUNTHORN; Nathapong ; et al.	2015-04-16
Semiconductor device and method of forming a shielding layer between stacked semiconductor die Grant 8,907,498 - Pagaila , et al. December 9, 2	2014-12-09
Semiconductor packages and methods of packaging semiconductor devices Grant 8,860,079 - Ng , et al. October 14, 2	2014-10-14
Semiconductor packages and methods of packaging semiconductor devices Grant 8,829,666 - Ng , et al. September 9, 2	2014-09-09
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20140227832 - WANG; Chuen Khiang ; et al.	2014-08-14
Leadframe Area Array Packaging Technology App 20140138808 - Dimaano, JR.; Antonio Bambalan ; et al.	2014-05-22
Semiconductor packages and methods of packaging semiconductor devices Grant 8,716,873 - Wang , et al. May 6, 2	2014-05-06
Semiconductor Device Having an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20140110861 - Suthiwongsunthorn; Nathapong ; et al.	2014-04-24
Semiconductor device and method of forming conductive TSV with insulating annular ring Grant 8,703,610 - Pagaila , et al. April 22, 2	2014-04-22
Semiconductor device having an interconnect structure with TSV using encapsulant for structural support Grant 8,659,162 - Suthiwongsunthorn , et al. February 25, 2	2014-02-25
Semiconductor Device and Method of Forming a Thin Wafer Without a Carrier App 20130285236 - Marimuthu; Pandi C. ; et al.	2013-10-31
Semiconductor device and method of forming a thin wafer without a carrier Grant 8,531,015 - Marimuthu , et al. September 10, 2	2013-09-10
Semiconductor Device and Method of Forming Conductive TSV With Insulating Annular Ring App 20130087928 - Pagaila; Reza A. ; et al.	2013-04-11
Semiconductor Device and Method of Forming a Shielding Layer Between Stacked Semiconductor Die App 20130087897 - Pagaila; Reza A. ; et al.	2013-04-11
Semiconductor device and method of forming a shielding layer between stacked semiconductor die Grant 8,378,383 - Pagaila , et al. February 19, 2	2013-02-19
Semiconductor device and method of forming conductive TSV with insulating annular ring Grant 8,349,735 - Pagaila , et al. January 8, 2	2013-01-08
Semiconductor device and method of forming an interposer package with through silicon vias Grant 8,263,439 - Marimuthu , et al. September 11, 2	2012-09-11
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20120220082 - NG; Catherine Bee Liang ; et al.	2012-08-30
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20120119378 - NG; Catherine Bee Liang ; et al.	2012-05-17
Semiconductor Die and Method of Forming Noise Absorbing Regions Between THVs in Peripheral Region of the Die App 20120091567 - Pagaila; Reza A. ; et al.	2012-04-19
Semiconductor device and method of forming conductive TSV with insulating annular ring App 20120068313 - Pagaila; Reza A. ; et al.	2012-03-22
Wafer integrated with permanent carrier and method therefor Grant 8,125,073 - Han , et al. February 28, 2	2012-02-28
Semiconductor Device Having an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20120013004 - Suthiwongsunthorn; Nathapong ; et al.	2012-01-19
Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die Grant 8,093,151 - Pagaila , et al. January 10, 2	2012-01-10
Semiconductor Packages And Methods Of Packaging Semiconductor Devices App 20120001306 - WANG; Chuen Khiang ; et al.	2012-01-05
Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support Grant 8,067,308 - Suthiwongsunthorn , et al. November 29, 2	2011-11-29
Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support Grant 8,049,328 - Marimuthu , et al. November 1, 2	2011-11-01
Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief Grant 8,017,515 - Marimuthu , et al. September 13, 2	2011-09-13
Wafer Integrated With Permanent Carrier and Method Therefor App 20110101509 - Han; Byung Joon ; et al.	2011-05-05
Semiconductor Device and Method of Forming an Interposer Package with Through Silicon Vias App 20110024916 - Marimuthu; Pandi Chelvam ; et al.	2011-02-03
Wafer integrated with permanent carrier and method therefor Grant 7,880,293 - Han , et al. February 1, 2	2011-02-01
Method and apparatus for wafer level integration using tapered vias Grant 7,863,721 - Suthiwongsunthorn , et al. January 4, 2	2011-01-04
Semiconductor Device and Method of Forming an Interconnect Structure with TSV Using Encapsulant for Structural Support App 20100308443 - Suthiwongsunthorn; Nathapong ; et al.	2010-12-09
Semiconductor device and method of forming an interposer package with through silicon vias Grant 7,838,337 - Marimuthu , et al. November 23, 2	2010-11-23
Semiconductor Device and Method of Forming a Shielding Layer Between Stacked Semiconductor Die App 20100244208 - Pagaila; Reza A. ; et al.	2010-09-30
Semiconductor Device and Method of Forming a Thin Wafer Without a Carrier App 20100244241 - Marimuthu; Pandi Chelvam ; et al.	2010-09-30
Semiconductor Die and Method of Forming Noise Absorbing Regions Between THVS in Peripheral Region of the Die App 20100230822 - Pagaila; Reza A. ; et al.	2010-09-16
Semiconductor Device and Method of Forming an Interconnect Structure for 3-D Devices Using Encapsulant for Structural Support App 20100221873 - Marimuthu; Pandi Chelvam ; et al.	2010-09-02
Semiconductor Device and Method of Forming an Interconnect Structure for 3-D Devices Using Encapsulant for Structural Support App 20100213610 - Marimuthu; Pandi Chelvam ; et al.	2010-08-26
Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support Grant 7,741,148 - Marimuthu , et al. June 22, 2	2010-06-22
Semiconductor Device and Method of Forming Compliant Polymer Layer Between UBM and Conformal Dielectric Layer/RDL for Stress Relief App 20100140752 - Marimuthu; Pandi Chelvam ; et al.	2010-06-10
Semiconductor Device And Method Of Forming An Interconnect Structure For 3-d Devices Using Encapsulant For Structural Support App 20100140815 - Marimuthu; Pandi Chelvam ; et al.	2010-06-10
Semiconductor Device and Method of Forming an Interposer Package with Through Silicon Vias App 20100133704 - Marimuthu; Pandi Chelvam ; et al.	2010-06-03
Method and Apparatus for Wafer Level Integration Using Tapered Vias App 20090309235 - Suthiwongsunthorn; Nathapong ; et al.	2009-12-17
Wafer Integrated with Permanent Carrier and Method Therefor App 20090243083 - Han; Byung Joon ; et al.	2009-10-01

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