Suter; Guido

Patent Applications and Registrations

Patent applications and USPTO patent grants for Suter; Guido.The latest application filed is for "through-type furnace for substrates to be fitted with components and die bonder".

Company Profile

0.5.8

Suter; Guido - Geuensee CH
Suter; Guido - Hamburg DE
Suter; Guido - Steinhausen CH
Suter, Guido - US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Through type furnace for substrates comprising a longitudinal slit Grant 9,666,460 - Suter , et al. May 30, 2	2017-05-30
Apparatus for mounting semiconductor chips Grant 9,603,294 - Suter , et al. March 21, 2	2017-03-21
Through-Type Furnace For Substrates To Be Fitted With Components And Die Bonder App 20150136836 - Suter; Guido ; et al.	2015-05-21
Prostate Cancer Markers App 20140051082 - Schweiger; Michal ; et al.	2014-02-20
Apparatus For Mounting Semiconductor Chips App 20130133188 - Suter; Guido ; et al.	2013-05-30
Apparatus for the transport and equipping of substrates with semiconductor chips Grant 6,820,793 - Kellenberger , et al. November 23, 2	2004-11-23
Method and apparatus for dispensing solder on a substrate Grant 6,811,074 - Suter , et al. November 2, 2	2004-11-02
Apparatus for transporting substrates in an oven App 20030190574 - Schmid, Reto ; et al.	2003-10-09
Method and apparatus for dispensing solder on a substrate App 20030168498 - Suter, Guido ; et al.	2003-09-11
Apparatus for the transport and equipping of substrates with semiconductor chips App 20030022416 - Kellenberger, Daniel ; et al.	2003-01-30

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