Susko; Robin A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Susko; Robin A..The latest application filed is for "structures and methods to reduce maximum current density in a solder ball".
- Susko; Robin A. - Owego NY
- Susko; Robin A. - Owega NY
| Patent | Date |
|---|---|
| Structures and methods to reduce maximum current density in a solder ball Grant 8,674,506 - Bezama , et al. March 18, 2 | 2014-03-18 |
| Structures And Methods To Reduce Maximum Current Density In A Solder Ball App 20130234329 - BEZAMA; Raschid J. ; et al. | 2013-09-12 |
| Structures and methods to reduce maximum current density in a solder ball Grant 8,446,006 - Bezama , et al. May 21, 2 | 2013-05-21 |
| Structures And Methods To Reduce Maximum Current Density In A Solder Ball App 20110147922 - BEZAMA; Raschid J. ; et al. | 2011-06-23 |
| Sandwiched organic LGA structure Grant 7,795,724 - Brodsky , et al. September 14, 2 | 2010-09-14 |
| Thermal pillow Grant 7,709,951 - Brodsky , et al. May 4, 2 | 2010-05-04 |
| Sandwiched Organic Lga Structure App 20090057865 - Brodsky; William L. ; et al. | 2009-03-05 |
| Thermal Pillow App 20080225484 - Brodsky; William L. ; et al. | 2008-09-18 |
| Temperature dependent semiconductor module connectors Grant 7,255,571 - Brodsky , et al. August 14, 2 | 2007-08-14 |
| Temperature dependent semiconductor module connectors App 20070010111 - Brodsky; William L. ; et al. | 2007-01-11 |
| Temperature dependent semiconductor module connectors Grant 7,137,826 - Brodsky , et al. November 21, 2 | 2006-11-21 |
| Hook interconnect Grant 7,128,579 - Brodsky , et al. October 31, 2 | 2006-10-31 |
| Temperature Dependent Semiconductor Module Connectors App 20060205273 - Brodsky; William L. ; et al. | 2006-09-14 |
| Semiconductor structure interconnector and assembly Grant 6,059,579 - Kresge , et al. May 9, 2 | 2000-05-09 |
| Method and apparatus for flexibly connecting electronic devices Grant 5,956,235 - Kresge , et al. September 21, 1 | 1999-09-21 |
| Electrical and/or thermal interconnections and methods for obtaining such Grant 5,189,261 - Alexander , et al. February 23, 1 | 1993-02-23 |
| Method for laminating organic materials via surface modification Grant 4,908,094 - Jones , et al. March 13, 1 | 1990-03-13 |
| Plasma reactor having segmented electrodes Grant 4,885,074 - Susko , et al. December 5, 1 | 1989-12-05 |
| Method of making sloped vias Grant 4,830,706 - Horwath , et al. May 16, 1 | 1989-05-16 |
| Process for removing contaminant Grant 4,654,115 - Egitto , et al. March 31, 1 | 1987-03-31 |
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