Susai; Lawrence Selvaraj

Patent Applications and Registrations

Patent applications and USPTO patent grants for Susai; Lawrence Selvaraj.The latest application filed is for "inductive devices and methods of fabricating inductive devices".

Company Profile

4.4.11

Susai; Lawrence Selvaraj - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Transistor devices and methods of forming transistor devices Grant 11,444,168 - Lei , et al. September 13, 2	2022-09-13
Transistor devices and methods of forming a transistor device Grant 11,380,677 - Lei , et al. July 5, 2	2022-07-05
Inductive Devices And Methods Of Fabricating Inductive Devices App 20220189673 - SYED MOHAMMED; Zishan Ali ; et al.	2022-06-16
Transistor And Methods Of Fabricating A Transistor App 20220157977 - LEI; Jiacheng ; et al.	2022-05-19
Transistor Devices And Methods Of Forming Transistor Devices App 20220140096 - LEI; Jiacheng ; et al.	2022-05-05
Inductor Capacitor Filter In Far Back End Of Line And Integration Schemes App 20220068809 - PENG; LULU ; et al.	2022-03-03
Structures For A High-electron-mobility Transistor And Related Methods App 20210351286 - Lei; Jiacheng ; et al.	2021-11-11
Transistor Devices And Methods Of Forming A Transistor Device App 20210335778 - LEI; Jiacheng ; et al.	2021-10-28
Inductive Devices And Methods Of Forming Inductive Devices App 20210202165 - SYED MOHAMMED; Zishan Ali ; et al.	2021-07-01
Semiconductor Devices And Methods Of Fabricating A Semiconductor Device App 20210111243 - SUSAI; Lawrence Selvaraj ; et al.	2021-04-15
3-dimensional printing process for integrated magnetics Grant 10,825,888 - Peng , et al. November 3, 2	2020-11-03
3-dimensional Printing Process For Integrated Magnetics App 20190319085 - PENG; Lulu ; et al.	2019-10-17
3-dimensional printing process for integrated magnetics Grant 10,446,639 - Peng , et al. Oc	2019-10-15
A 3-dimensional Printing Process For Integrated Magnetics App 20180286940 - PENG; Lulu ; et al.	2018-10-04
Bonding Of Iii-v-and-si Substrates With Interconnect Metal Layers App 20180269105 - SUSAI; Lawrence Selvaraj ; et al.	2018-09-20

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