Suryakumar; Mahadevan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Suryakumar; Mahadevan.The latest application filed is for "coaxial plated through holes (pth) for robust electrical performance".

Company Profile

1.3.11

Suryakumar; Mahadevan - Gilbert AZ
Suryakumar; Mahadevan - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Coaxial Plated Through Holes (pth) For Robust Electrical Performance App 20130189812 - Roy; Mihir ; et al.	2013-07-25
Coaxial plated through holes (PTH) for robust electrical performance Grant 8,227,706 - Roy , et al. July 24, 2	2012-07-24
Coreless Substrate, Method Of Manufacturing Same, And Package For Microelectronic Device Incorporating Same App 20120005887 - Mortensen; Russell ; et al.	2012-01-12
Microelectronic Package And Method Of Manufacturing Same App 20110318850 - Guzek; John S. ; et al.	2011-12-29
Coaxial Plated Through Holes (pth) For Robust Electrical Performance App 20100163295 - Roy; Mihir ; et al.	2010-07-01
Coreless substrate, method of manufacturing same, and package for microelectronic device incorporating same App 20100073894 - Mortensen; Russell ; et al.	2010-03-25
Routing configuration for high frequency signals in an integrated circuit package Grant 7,586,192 - Suryakumar September 8, 2	2009-09-08
Array capacitor for decoupling multiple voltages App 20080157313 - Dattaguru; Sriram ; et al.	2008-07-03
Reducing layer count in semiconductor packages App 20070231951 - Suryakumar; Mahadevan	2007-10-04
Package substrate for integrated circuit and method of making the substrate Grant 7,152,313 - Wood , et al. December 26, 2	2006-12-26
Routing configuration for high frequency signals in an integrated circuit package App 20060208355 - Suryakumar; Mahadevan	2006-09-21
Package substrate for integrated circuit and method of making the substrate App 20050111207 - Wood, Dustin P. ; et al.	2005-05-26
Package structure with increased capacitance and method App 20040217469 - Suryakumar, Mahadevan	2004-11-04

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