Surowka; John Frank
Patent Applications and Registrations
Patent applications and USPTO patent grants for Surowka; John Frank.The latest application filed is for "method for reducing coefficient of thermal expansion in chip attach packages".
- Surowka; John Frank - Binghamton NY
| Patent | Date |
|---|---|
| Method for reducing coefficient of thermal expansion in chip attach packages Grant 6,841,026 - Blumberg , et al. January 11, 2 | 2005-01-11 |
| Method for reducing coefficient of thermal expansion in chip attach packages App 20030000081 - Blumberg, Lawrence Robert ; et al. | 2003-01-02 |
| Laminated electroplating rack and connection system for optimized plating Grant 6,176,985 - Downes, Jr. , et al. January 23, 2 | 2001-01-23 |
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