| Patent | Date |
|---|
Controlled fluid delivery in a microelectronic package
Grant 9,604,210 - Supriya , et al. March 28, 2 | 2017-03-28 |
Meltprocessed fluoropolymer article and method for melt-processing fluoropolymers
Grant 9,156,973 - Supriya , et al. October 13, 2 | 2015-10-13 |
Controlled fluid delivery in a microelectronic package
Grant 9,101,931 - Supriya , et al. August 11, 2 | 2015-08-11 |
Controlled Fluid Delivery In A Microelectronic Package
App 20150209780 - Supriya; Lakshmi ; et al. | 2015-07-30 |
Thermally conductive device with a thermal interface material
Grant 8,592,972 - Supriya , et al. November 26, 2 | 2013-11-26 |
Methods Of Processing A Thermal Interface Material
App 20130140014 - Supriya; Lakshmi ; et al. | 2013-06-06 |
Meltprocessed Fluoropolymer Article And Method For Melt-processing Fluoropolymers
App 20130085220 - Supriya; Lakshmi ; et al. | 2013-04-04 |
Methods of processing a thermal interface material
Grant 8,383,459 - Supriya , et al. February 26, 2 | 2013-02-26 |
Apparatus and methods of forming an interconnect between a workpiece and substrate
Grant 8,183,697 - Supriya , et al. May 22, 2 | 2012-05-22 |
Methods to fabricate functionally gradient materials and structures formed thereby
Grant 8,173,259 - Supriya , et al. May 8, 2 | 2012-05-08 |
Method of forming an interconnect joint
Grant 8,124,517 - Supriya , et al. February 28, 2 | 2012-02-28 |
Multiple Die Structure And Method Of Forming A Connection Between First And Second Dies In Same
App 20110240349 - Supriya; Lakshmi ; et al. | 2011-10-06 |
Multiple die structure and method of forming a connection between first and second dies in same
Grant 8,017,498 - Supriya , et al. September 13, 2 | 2011-09-13 |
Apparatus And Methods Of Forming An Interconnect Between A Workpiece And Substrate
App 20110074023 - Supriya; Lakshmi ; et al. | 2011-03-31 |
Apparatus and methods of forming an interconnect between a workpiece and substrate
Grant 7,843,075 - Supriya , et al. November 30, 2 | 2010-11-30 |
Method Of Forming An Interconnect Joint
App 20100276474 - Supriya; Lakshmi ; et al. | 2010-11-04 |
Forming vias using sacrificial material
Grant 7,727,886 - Supriya , et al. June 1, 2 | 2010-06-01 |
Multiple die structure and method of forming a connection between first and second dies in same
App 20100072617 - Supriya; Lakshmi ; et al. | 2010-03-25 |
Microball attachment using self-assembly for substrate bumping
Grant 7,651,021 - Supriya , et al. January 26, 2 | 2010-01-26 |
Methods Of Processing A Thermal Interface Material
App 20090317641 - Supriya; Lakshmi ; et al. | 2009-12-24 |
Apparatus and methods of forming an interconnect between a workpiece and substrate
App 20090273914 - Supriya; Lakshmi ; et al. | 2009-11-05 |
Formation of holes in substrates using dewetting coatings
Grant 7,611,985 - Matayabas, Jr. , et al. November 3, 2 | 2009-11-03 |
Microball Attachment Using Self-assembly For Substrate Bumping
App 20090166396 - SUPRIYA; Lakshmi ; et al. | 2009-07-02 |
Controlled Fluid Delivery In A Microelectronic Package
App 20090169427 - Supriya; Lakshmi ; et al. | 2009-07-02 |
Methods To Fabricate Functionally Gradient Materials And Structures Formed Thereby
App 20090087644 - Supriya; Lakshmi ; et al. | 2009-04-02 |
Forming vias using sacrificial material
App 20090004841 - Supriya; Lakshmi ; et al. | 2009-01-01 |
Method Of Forming An Interconnect Joint
App 20080311738 - Supriya; Lakshmi ; et al. | 2008-12-18 |
Methods For Electroless Plating Of Metal Traces On A Substrate And Devices And Systems Thereof
App 20080160177 - Mataybas; J. C. ; et al. | 2008-07-03 |
Formation Of Holes In Substrates Using Dewetting Coatings
App 20080070349 - Matayabas; James C. ; et al. | 2008-03-20 |
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