| Patent | Date |
|---|
Method of forming high resolution circuitry by depositing a polyvinyl alcohol layer beneath a photosensitive polymer layer
Grant 5,773,198 - Swirbel , et al. June 30, 1 | 1998-06-30 |
Gas detection system for a portable communication
Grant 5,771,004 - Suppelsa , et al. June 23, 1 | 1998-06-23 |
Method of selectively releasing plastic molding material from a surface
Grant 5,542,171 - Juskey , et al. August 6, 1 | 1996-08-06 |
Housing with integral thin film resistive snap-fits
Grant 5,536,917 - Suppelsa , et al. July 16, 1 | 1996-07-16 |
Leaded semiconductor package having temperature controlled lead length
Grant 5,455,446 - Suppelsa , et al. October 3, 1 | 1995-10-03 |
Light erasable multichip module
Grant 5,438,216 - Juskey , et al. August 1, 1 | 1995-08-01 |
Method of manufacturing a circuit carrying substrate having coaxial via holes
Grant 5,421,083 - Suppelsa , et al. June 6, 1 | 1995-06-06 |
Encapsulated electronic component having a heat diffusing layer
Grant 5,379,186 - Gold , et al. January 3, 1 | 1995-01-03 |
Self centering coil
Grant 5,373,276 - Suppelsa , et al. December 13, 1 | 1994-12-13 |
Thermally conductive integrated circuit package with radio frequency shielding
Grant 5,371,404 - Juskey , et al. December 6, 1 | 1994-12-06 |
EPROM package and method of optically erasing
Grant 5,300,808 - Suppelsa , et al. April 5, 1 | 1994-04-05 |
Selectively releasing conductive runner and substrate assembly
Grant 5,280,139 - Suppelsa , et al. January 18, 1 | 1994-01-18 |
Method of forming a three-dimensional printed circuit assembly
Grant 5,264,061 - Juskey , et al. November 23, 1 | 1993-11-23 |
Method for solder application and reflow
Grant 5,255,839 - da Costa Alves , et al. October 26, 1 | 1993-10-26 |
Non-hardening solvent removable hydrophobic conformal coatings
Grant 5,232,758 - Juskey , et al. August 3, 1 | 1993-08-03 |
Method of making a transfer molded semiconductor device
Grant 5,218,759 - Juskey , et al. June 15, 1 | 1993-06-15 |
Molded ring integrated circuit package
Grant 5,177,669 - Juskey , et al. January 5, 1 | 1993-01-05 |
Soldering method
Grant 5,172,852 - Bernardoni , et al. December 22, 1 | 1992-12-22 |
Method and apparatus for two sided solder cladded surface mounted printed circuit boards
Grant 5,167,361 - Liebman , et al. December 1, 1 | 1992-12-01 |
Selectively releasing conductive runner and substrate assembly having non-planar areas
Grant 5,166,774 - Banerji , et al. November 24, 1 | 1992-11-24 |
Transmission line using fluroplastic as a dielectric
Grant 5,065,122 - Juskey , et al. November 12, 1 | 1991-11-12 |
Method of making high density solder bumps and a substrate socket for high density solder bumps
Grant 5,024,372 - Altman , et al. June 18, 1 | 1991-06-18 |
Process for photoimaging a three dimensional printed circuit substrate
Grant 5,001,038 - Dorinski , et al. March 19, 1 | 1991-03-19 |
Pad grid array for receiving a solder bumped chip carrier
Grant 4,940,181 - Juskey, Jr. , et al. July 10, 1 | 1990-07-10 |
Moldable/foldable radio housing
Grant 4,939,792 - Urbish , et al. July 3, 1 | 1990-07-03 |
Ultra thin radio housing with integral antenna
Grant 4,894,663 - Urbish , et al. January 16, 1 | 1990-01-16 |
Method of trimming thick film capacitor
Grant 4,338,506 - Geller , et al. July 6, 1 | 1982-07-06 |
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