Suo; Peng

Patent Applications and Registrations

Patent applications and USPTO patent grants for Suo; Peng.The latest application filed is for "methods of forming through-silicon vias in substrates for advanced packaging".

Company Profile

6.4.8

Suo; Peng - Singapore SG
Suo; Peng - Singapore Science Park SG
Suo; Peng - Singapore Science Park 2 SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods of forming through-silicon vias in substrates for advanced packaging Grant 11,404,318 - Suo , et al. August 2, 2	2022-08-02
Method of forming a magnetic core on a substrate Grant 11,373,803 - Suo , et al. June 28, 2	2022-06-28
Methods Of Forming Through-silicon Vias In Substrates For Advanced Packaging App 20220165621 - SUO; Peng ; et al.	2022-05-26
Semiconductor Substrate Having Magnetic Core Inductor And Method Of Making Same App 20210233707 - Suo; Peng ; et al.	2021-07-29
Methods And Apparatus For Wafer-level Packaging Using Direct Writing App 20210202334 - SUO; PENG ; et al.	2021-07-01
Methods And Apparatus For Removing Abrasive Particles App 20200306931 - LIANTO; PRAYUDI ; et al.	2020-10-01
Methods for forming vias in polymer layers Grant 10,636,696 - Gu , et al.	2020-04-28
Methods and apparatus for 3D MIM capacitor package processing Grant 10,475,735 - Suo , et al. Nov	2019-11-12
Methods And Apparatus For Embedded Antifuses App 20190287898 - SUO; PENG ; et al.	2019-09-19
Semiconductor Substrate Having Magnetic Core Inductor And Method Of Making Same App 20190051454 - Suo; Peng ; et al.	2019-02-14
Method Of Increasing Embedded 3d Metal-insulator-metal (mim) Capacitor Capacitance Density For Wafer Level Packaging App 20190051596 - Suo; Peng ; et al.	2019-02-14
Methods And Apparatus For 3d Mim Capacitor Package Processing App 20180366401 - Suo; Peng ; et al.	2018-12-20

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