Sung; Yung-Ta
Patent Applications and Registrations
Patent applications and USPTO patent grants for Sung; Yung-Ta.The latest application filed is for "conductive interconnects and methods of forming conductive interconnects".
- Sung; Yung-Ta - Boise ID
| Patent | Date |
|---|---|
| Conductive Interconnects and Methods of Forming Conductive Interconnects App 20220199123 - Ahmed; Raju ; et al. | 2022-06-23 |
| Conductive interconnects and methods of forming conductive interconnects Grant 11,328,749 - Ahmed , et al. May 10, 2 | 2022-05-10 |
| Conductive Interconnects and Methods of Forming Conductive Interconnects App 20210249304 - Ahmed; Raju ; et al. | 2021-08-12 |
| Conductive Interconnects and Methods of Forming Conductive Interconnects App 20210193189 - Ahmed; Raju ; et al. | 2021-06-24 |
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